HDI board and inner layer anomaly detection method and device of HDI board

An abnormal detection and inner layer technology, applied in metal processing equipment, work carriers, grinding machine tools, etc., can solve the problems of difficulty in controlling the amount of grinding, low analysis success rate, and prone to grinding, etc., to improve efficiency and accuracy. The effect of low operation difficulty and improved accuracy

Active Publication Date: 2022-02-15
湖北金禄科技有限公司
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Problems solved by technology

This method is difficult to control the amount of grinding, it is easy to appear the phenomenon of grinding, and the analysis success rate is low

Method used

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  • HDI board and inner layer anomaly detection method and device of HDI board
  • HDI board and inner layer anomaly detection method and device of HDI board
  • HDI board and inner layer anomaly detection method and device of HDI board

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Embodiment Construction

[0038] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0039] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

The invention provides an HDI board and an inner layer anomaly detection method and device of the HDI board. A manufacturing method of a circuit board comprises the steps: providing the HDI board; positioning the rack HDI board on a grinding table top; performing coarse positioning on a preset defect position of the rack HDI board; and controlling a grinding rotating head to grind the preset defect position of a rack at a preset grinding stroke and a preset grinding rotating speed so as to peel off a detection obstacle and expose a to-be-detected area, wherein a multi-stage rotating speed sub-control module is used for controlling the preset grinding rotating speed of the rack. Compared with a slicing grinding method, the grinding success rate and efficiency are greatly improved, and meanwhile the grinding operation difficulty is reduced; and according to the inner layer anomaly detection method, the numerical values of the preset grinding rotating speed and the preset grinding stroke are set in advance, so that compared with a traditional layer stripping method, the inner layer anomaly detection method is low in operation difficulty and high in efficiency, meanwhile, the operation safety of detection is improved, and the problem that the safety coefficient of the layer stripping method is low is solved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to an HDI board, an inner layer abnormality detection method and equipment of the HDI board. Background technique [0002] HDI board (High Density Interconnector Board, high-density interconnection board) is a kind of printed circuit board. It adopts micro-blind buried hole technology and has a relatively high line distribution density, so that the HDI board takes up less space and is suitable for miniaturization. electronic product. The HDI board is a structural element formed by insulating materials supplemented by conductor wiring. When the final product is made, integrated circuits, transistors (such as triodes or diodes), passive components (such as resistors, capacitors, or connections) will be installed on it. devices, etc.) and various other electronic components. [0003] In the manufacturing process, in order to improve the production yield of the HDI board, it is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00B24B37/11B24B37/27B24B37/34
CPCB24B37/00B24B37/11B24B37/27B24B37/34
Inventor 时越周爱明严杰廖明敏
Owner 湖北金禄科技有限公司
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