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High-thermal-conductivity thermoplastic material containing graphene nanoplatelets and preparation method of high-thermal-conductivity thermoplastic material
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A technology of graphene microchips and thermoplastic materials, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve problems such as uneven heat transfer, large particle size difference of thermoplastic materials, and failure to meet requirements, etc., to reduce manufacturing costs cost, increase thermal conductivity, and avoid uneven heat conduction
Pending Publication Date: 2022-02-15
SUZHOU POLYKING COMPOSITE
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[0002] Thermoplastic materials refer to materials with heating softening and cooling hardening characteristics. Commonly used thermoplastic materials include polyethylene, polypropylene, polystyrene, polyvinyl chloride and nylon, etc., which are widely used in coatings, electrical appliances and automobiles. The existing thermoplastic In order to increase thermal conductivity, fillers such as graphene microflakes and carbon nanotubes are often added to materials, but the thermal conductivity of graphene microflakes alone is limited and cannot meet the requirements; adding a large amount of graphene microflakes is not conducive to controlling the production cost of thermoplastic materials; The difference in particle size of the produced thermoplastic material is too large, which may easily lead to uneven heat transfer
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Embodiment 1
[0022] High thermal conductivity thermoplastic material containing graphene micro flakes, the formula includes: thermoplastic resin, tackifying resin, metal filler, ceramic filler, graphene micro flakes, flame retardant and elastic filler, the mass percentage content of each component is: 66 % thermoplastic resin, 14% tackifying resin, 3% metal filler, 2.7% ceramic filler, 1.3% graphene microflakes, 3% flame retardant and 10% elastic filler.
[0023] The preparation method of the high thermal conductivity thermoplastic material containing graphene microflakes comprises step 1, weighing raw materials; step 2, drying at high temperature; step 3, making mixture; step 4, preparing thermoplastic material particles; step 5, sieving and storing;
[0024] Wherein in the above-mentioned step one, according to the mass percentage of each component, it is respectively: 66% thermoplastic resin, 14% tackifying resin, 3% metal filler, 2.7% ceramic filler, 1.3% graphene microchip , 3% flame ...
Embodiment 2
[0030] High thermal conductivity thermoplastic material containing graphene microflakes, the formula includes: thermoplastic resin, tackifying resin, metal filler, ceramic filler, graphene microflakes, flame retardant and elastic filler, the mass percentage content of each component is: 65 % thermoplastic resin, 16% tackifying resin, 2% metal filler, 2.3% ceramic filler, 1.2% graphene microflakes, 2.5% flame retardant and 11% elastic filler.
[0031] The preparation method of the high thermal conductivity thermoplastic material containing graphene microflakes comprises step 1, weighing raw materials; step 2, drying at high temperature; step 3, making mixture; step 4, preparing thermoplastic material particles; step 5, sieving and storing;
[0032] Wherein in the above-mentioned step one, according to the mass percentage of each component, it is respectively: 65% thermoplastic resin, 16% tackifying resin, 2% metal filler, 2.3% ceramic filler, 1.2% graphene microchip , 2.5% flam...
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Abstract
The invention discloses a high-thermal-conductivitythermoplastic material containing graphene nanoplatelets and a preparation method of the high-thermal-conductivitythermoplastic material. A formula of the high-thermal-conductivitythermoplastic material comprises thermoplastic resin, tackifying resin, metal filler, ceramic filler, a flame retardant and elastic filler. The preparation method comprises the steps: step 1, weighing raw materials; step 2, carrying out high-temperature drying; step 3, preparing a mixture; step 4, preparing thermoplastic material particles; and step 5, screening and storing. In the step 1, the tackifying resin is one or a mixture of more of rosin, rosin derivatives and terpene resin, the metal filler is berylliumoxide, and the ceramic filler is siliconnitride. Compared with an existing high-thermal-conductivity thermoplastic material, the high-thermal-conductivity thermoplastic material has the advantages that the metal filler and the ceramic filler are added to form a thermal conductive net, and the thermal conductivity of the material is improved; and according to the invention, the use amount of the graphene nanoplatelets is reduced, so that the manufacturing cost required by the material is reduced; and by screening particles with small particlesize difference, the problem of non-uniform heat conduction of the material is avoided.
Description
technical field [0001] The invention relates to the technical field of material preparation, in particular to a high thermal conductivity thermoplastic material containing graphene microchips and a preparation method. Background technique [0002] Thermoplastic materials refer to materials with heating softening and cooling hardening characteristics. Commonly used thermoplastic materials include polyethylene, polypropylene, polystyrene, polyvinyl chloride and nylon, etc., which are widely used in coatings, electrical appliances and automobiles. The existing thermoplastic In order to increase thermal conductivity, fillers such as graphene microflakes and carbon nanotubes are often added to materials, but the thermal conductivity of graphene microflakes alone is limited and cannot meet the requirements; adding a large amount of graphene microflakes is not conducive to controlling the production cost of thermoplastic materials; The difference in the particle size of the produce...
Claims
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Application Information
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