Micro-system electromagnetic field fine tuning medium cavity structure

Abstract

A micro-system radio frequency electromagnetic field fine tuning medium cavity device disclosed by the invention has good electromagnetic isolation performance. According to the technical scheme, the center of the top end of a top-bottom metal layer is provided with a non-metal rectangular isolation pool, a metalized circular array hole surrounding a metalized central through hole and communicated with a dielectric cavity, and a cross-shaped connecting line hole forming a cross-shaped linear array cross connecting line; the bottom metal layer at the bottom end of the dielectric cavity is provided with an insulating platform and a cascaded chip set which are separated by a separation groove, a microstrip transmission line which is separated by the separation groove and extends to a dielectric opening radio frequency signal exchange port is connected with the chip set to form a waveguide structure coplanar with the bottom metal layer, a physical model with IBC electromagnetic scattering characteristics is established by combining the inner wall of the dielectric cavity, electromagnetic waves are reflected for multiple times in the dielectric cavity, and the radio frequency performance in the dielectric cavity is adjusted through the metalized circular array hole and the cross-shaped connecting line hole, so that debugging of the radio frequency performance after three-dimensional integration and microsystem integration packaging is achieved.

Description

technical field [0001] The invention relates to a radio frequency dielectric cavity structure with cross-shaped cross and circular array metallized holes, in particular, it relates to a dielectric cavity capable of fine-tuning the electromagnetic field in the cavity in the field of radio frequency three-dimensional integration and microsystem integration body structure. Background technique [0002] In order to adapt to the miniaturization of modern radio frequency equipment, electronic equipment is constantly developing from traditional two-dimensional plane integration to radio frequency three-dimensional integration and microsystemization. In RF three-dimensional integration and microsystem integration, ceramic dielectric substrates (HTCC / LTCC), silicon substrates, glass substrates, etc. are often used as RF circuit adapter boards, and special cavity structures are set on the adapter boards to place various Like active or passive devices, the signal connection between RF...

AI Technical Summary

Problems solved by technology

If microstrip lines, pads, and various devices are added to the substrate, the internal structure of the entire cavity is complicated at this time, so that the yield of current RF 3D and microsystem integration products is low, which increases manpower and economic costs.

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