Novel wafer surface drying device

Abstract

The invention discloses a novel wafer surface drying device which comprises a drying frame, crosspieces are installed on the front face and the back face of the drying frame, a detection frame and a marking frame are installed on the surfaces, away from each other, of the two crosspieces, and a conveying fan is installed at the top of the crosspiece in the front; a connecting frame is installed on the back face of the conveying fan, an infrared thermometer is installed on the top of the conveying fan, a hollow metal pipe is installed on the bottom wall of the connecting frame, three sets of air guide pipes arranged at equal intervals are installed in the metal pipe, and an electronic valve is electrically connected with the infrared thermometer. A liquid nitrogen pipe is connected to the top of the gas guide pipe in an embedded mode. According to the device, the conveying fan and the marking frame are arranged, whether the surface of the wafer has the swelling phenomenon or not can be detected through an ultrasonic range finder at the bottom of the marking frame, the swelling wafer is marked through an electric telescopic rod, an electric push rod and a marking plate, then screening and classification are conducted through the conveying fan, and good products and defective products are distinguished.

Description

technical field [0001] The invention relates to the technical field of wafer drying, in particular to a novel wafer surface drying device. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its round appearance after production, it is also called wafer. The raw material of wafer is silicon. The difference from silicon wafer is that wafer The surface of the silicon wafer contains integrated circuits, but there is no integrated circuit on the surface of the silicon wafer. After the wafer is produced, it needs to be dried to remove the etching liquid on the surface, so as to protect the normal use of the wafer. [0003] The defect that existing wafer drying device exists is: [0004] 1. The comparative document CN205843288U discloses a wafer dryer, "comprising a frame and a drying chamber on the frame, a hot air supply device is provided above the drying chamber for Conveying hot air,...

AI Technical Summary

Problems solved by technology

The utility model can realize rapid and uniform drying treatment of multiple groups of wafers, has good drying effect, does not occupy a large amount of ground space, has high drying efficiency, saves time and effort, and improves work efficiency." The drying device is performing wafer drying During dry processing, it is impossible to effectively count the actual yield rate of the wafer, and it is difficult to obtain statistical data on the quality of the wafer after drying;

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