The utility model relates to circuit board
processing technical field, concretely discloses a hot gas formula
tin -spraying device for
printed circuit board processing, including
processing bin, the left side of processing bin is provided with preheating subassembly, the inside of processing bin is provided with clamping subassembly, through the step -by -step heating of heating lamp inside preheating subassembly, to
slow heating reduces the thermal stress of circuit board, cooperate
infrared thermometer real -time detection
heating temperature simultaneously, guarantee the stability of temperature, subsequently through clamping subassembly clamping circuit board, immerse
tin liquid groove inside, after finishing, circuit board is placed in the surface of right side conveyer belt, through the operation of hot -blast even subassembly's hot -blast
machine, the
hot blast is guided into the inside of each fixed base in the bottom through first gas duct, subsequently through the inner
nozzle and outer
nozzle set up of fixed base bottom
tin liquid on circuit board surface blows flat, guarantees the evenness of tin
layer thickness, the
hot blast that blows out simultaneously accesses the
nitrogen gas in the
nitrogen gas tank, reduces the oxidation and
high temperature corrosion of circuit board.