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Intermediate connection member for electrically interconnecting two circuit units

A technology for circuit units and connecting components, applied in electrical components, two-part connection devices, connections, etc., can solve problems such as deformation, thin peeling, and maintaining high-precision machining

Pending Publication Date: 2022-02-25
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If an attempt is made to reduce the pitch between the via holes, the portion formed of the insulating material between the via holes becomes thin, and this leads to a problem that it is difficult to maintain high-precision processing while meeting the requirements for reducing the wiring pitch, such as when drilling Holes while thin parts are peeling off or deformed

Method used

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  • Intermediate connection member for electrically interconnecting two circuit units
  • Intermediate connection member for electrically interconnecting two circuit units
  • Intermediate connection member for electrically interconnecting two circuit units

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0058] figure 1 is an explanatory diagram of a digital camera 100 as an image pickup device serving as an example of an electronic device according to the first embodiment. The digital camera 100 is a digital camera with interchangeable lenses, and includes a camera body 101 . A lens barrel 102 including a lens is detachably attached to the camera body 101 . The lens barrel 102 is an interchangeable lens, that is, a lens unit.

[0059] The camera body 101 includes a casing 111 , and a camera module 200 and a processing module 400 disposed inside the casing 111 . The camera module 200 and the processing module 400 are electrically communicatively connected to each other via an unillustrated cable.

[0060] The camera module 200 is an example of an electronic module, and has a three-dimensional mounting structure. The camera module 200 includes circuit units 201 and 202 , and a plurality of intermediate connection members 300 . In this embodiment, the circuit unit 201 is us...

no. 2 example

[0118] Next, an intermediate connection member according to a second embodiment will be described. Figure 11A is a perspective view of an intermediate connection member 300A according to the second embodiment. Figure 11B yes Figure 11A An enlarged view of a portion of intermediate connecting member 300A is shown. It is to be noted that, in the second embodiment, substantially the same elements as those of the first embodiment are given the same reference numerals in the drawings and descriptions thereof will be omitted.

[0119] The intermediate connecting member 300A is a rigid plate having a rectangular parallelepiped shape, and its paired end faces 301 and 302 in the Z direction each serve as a connecting surface. The intermediate connection member 300A includes a plurality of wiring portions 311 and a plurality of wiring portions 312 .

[0120] The intermediate connection member 300A includes insulating substrate portions 321 and 322 . In addition, the intermediate ...

no. 3 example

[0133] Next, an intermediate connection member according to a third embodiment will be described. Figure 13 is a perspective view of an intermediate connection member 300B according to the third embodiment. It is to be noted that, in the third embodiment, elements substantially the same as those of the first embodiment are assigned the same reference numerals in the drawings and descriptions thereof are omitted. In addition, the manufacturing method for the intermediate connecting member 300B is also basically the same as that of the first embodiment, and thus description thereof will be omitted.

[0134] The intermediate connection member 300B includes insulating substrate portions 321 and 322 and an insulating layer portion 323 . In addition, the intermediate connecting member 300B includes a wiring portion group 311B composed of a plurality of first wiring portions and a wiring portion group 312B composed of a plurality of second wiring portions. The wiring portion group...

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PUM

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Abstract

The disclosure relates to an intermediate connection member, an electronic module, electronic equipment and a method for manufacturing the intermediate connection member. The intermediate connection member includes a first insulating substrate portion; a second insulating substrate portion; an insulating layer portion provided between the first insulating substrate portion and the second insulating substrate portion and formed from a different material from the first insulating substrate portion and the second insulating substrate portion; a plurality of first wiring portions provided between the first insulating substrate portion and the insulating layer portion so as to extend in a first direction such that both end portions of the plurality of first wiring portions in the first direction are exposed to an outside; and a plurality of second wiring portions provided between the second insulating substrate portion and the insulating layer portion so as to extend in the first direction such that both end portions of the plurality of second wiring portions in the first direction are exposed to the outside.

Description

technical field [0001] The present invention relates to an intermediate connecting member electrically interconnecting two circuit units. Background technique [0002] An imaging device including a camera as an example of an electronic device, such as a digital camera or a smartphone, includes a camera module as an example of an electronic module. The camera module includes multiple electronic components. In the case of a camera module, one of the electronic components is an image sensor. Each electronic component is mounted on a rigid board such as a printed wiring board, and due to the demand for miniaturization of electronic equipment, it is increasingly required to mount the electronic components at high density on the substrate in the camera module. [0003] As one example of a structure realizing high-density arrangement, a three-dimensional mounting structure composed of a multilayer structure formed by stacking circuit units is known. As a method for forming a thr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/26H01R24/00
CPCH01R43/26H01R24/00H01L27/14618H01L27/14634H01L27/14683H01L27/14636
Inventor 长谷川光利坪井典丈
Owner CANON KK