Oriented heat-conducting gel as well as preparation method and application thereof

Abstract

The invention relates to the field of thermal interface materials, and particularly discloses oriented heat-conducting gel as well as a preparation method and application thereof. The oriented heat-conducting gel group comprises the following raw materials: liquid resin, a spherical filler, an anisotropic filler, a retarder, a curing agent and a catalyst; the preparation method comprises the following steps: coating the oriented heat-conducting gel on a heat dissipation interface of a heating device of an electronic product in a dispensing manner, wherein the oriented heat-conducting gel exists on the heat dissipation interface of the electronic product in a glue point form; then the heat dissipation device is attached to the heating device through the viscidity of the orientation type heat conduction gel; and finally, curing and forming the oriented heat-conducting gel in a thermocuring or normal-temperature curing manner. The oriented heat-conducting gel can be used in the field of heat dissipation of electronic products. According to the oriented heat-conducting gel disclosed by the invention, the spherical filler and the anisotropic heat-conducting filler are reasonably proportioned and dispersed in the liquid resin, so that the prepared oriented heat-conducting gel has excellent heat-conducting property and also keeps relatively good extrusion property.

Description

technical field [0001] This application relates to the field of thermal interface materials, more specifically, it relates to an orientation type thermally conductive gel, its preparation method and its application. Background technique [0002] With the rapid popularization of the Internet, various electronic products are gradually developing in the direction of miniaturization, refinement and high power, resulting in a substantial increase in the integration density of transistors on electronic chips. The significant increase in the integration of electronic transistors means that electronic components packaged in circuit boards will generate more heat. If the heat generated during the operation of electronic components is not conducted in time, it will seriously affect the normal operation of electronic equipment. In order to improve the heat dissipation performance of electronic products, thermal interface materials are currently used as heat conduction media for heat d...

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Problems solved by technology

However, when the filling amount of the thermally conductive filler in the resin system is too high, the viscosity of the thermally conductive gel will increase, which will affect the dispensing characteristics or

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