High-precision fine resistance welding bridge method

Abstract

The invention belongs to the technical field of resistance welding bridges, and particularly relates to a high-precision thin resistance welding bridge method. According to the manufacturing method, a traditional one-time resistance welding manufacturing process is changed, a two-time resistance welding manufacturing process is adopted, and the first-time resistance welding manufacturing process aims at filling and leveling up the base material between the circuits and ensuring that the circuit does not become red when the ink thickness is reduced for the second time. That is, on the premise that the solder resist quality is met, the thickness of the second solder resist ink is reduced, the lateral erosion amount during solder resist development is reduced, a stable and reliable solder resist bridge with high compactness is obtained, an overall reliable solder resist layer is further obtained, and it is ensured that tin connection short circuit does not occur in the welding process.

Description

Technical field [0001] The present invention belongs to the technical field of soft and hard bond board processing, and is specifically a method of high precision fine barrier bridge. Background technique [0002] The presence of the solder welding as the protective layer of the line, the effective protection line copper is not corroded, and the patch does not short-circuit due to foreign matter or electrolytic solutions, widely used in the field of circuit board manufacturing. [0003] The existing soldering bridge production method is a direct production method. After the welding ink is pressed, it is performed, then the development, produce the needed barrier bridge, and ensure that the soldering bridge can guarantee that no welding does not Short circuit between the inter-disc. [0004] As electronic devices are getting more precipitating, the requirements for PCB are also increasingly high, and PCB lines are getting finer. At the same time, with the development of the packag...

AI Technical Summary

Problems solved by technology

The thicker the copper thickness, in order to ensure that there is no false exposed copper on the circuit board (thin solder mask ink on the shoulders, resulting in a decrease in insulation), the thicker the thickness of the solder mask; the thicker the thickness of the solder mask, the greater the amount of development and When the amount of side erosion on the side wall is greater, the bottom of the fine solder mask bridge will float, forming a bridge drop