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High-precision fine resistance welding bridge method

A solder-resisting bridge and high-precision technology, which is applied in the field of soft-hard board processing, can solve the problems of large amount of development and bridge drop, and achieve the effects of reducing thickness, increasing compactness, and solving bridge drop

Pending Publication Date: 2022-03-01
广德今腾电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thicker the copper thickness, in order to ensure that there is no false exposed copper on the circuit board (thin solder mask ink on the shoulders, resulting in a decrease in insulation), the thicker the thickness of the solder mask; the thicker the thickness of the solder mask, the greater the amount of development and When the amount of side erosion on the side wall is greater, the bottom of the fine solder mask bridge will float, forming a bridge drop

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0025] EXAMPLES, a high-precision fine barrier bridge method, including the following steps:

[0026] The first step: PCB board over horizontally blasted (volcanic ash, chemical cleaning) line, removes the plate surface oxidation and debris.

[0027] Step 2: Fix the PCB board and use the screen (aluminum sheet, the exposure station network) to perform plug holes (necessary), and the plug is directly on the two-sided oil wire printing, and the plate without the needle Direct silk screen two-sided oil.

[0028] Step 3: The PCB still 1h after the silk screen (the specific time can be determined according to the copper thickness), and then pre-raised.

[0029] Step 4: Use a negative or direct laser imaging to expose, the ink of the device hole, open the window, the opening substrate, retain the solder welding ink in the remaining position

[0030] Step 5: Curing the plate solder ink after the developing examination, the parameters can be determined according to the ink characteristics...

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PUM

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Abstract

The invention belongs to the technical field of resistance welding bridges, and particularly relates to a high-precision thin resistance welding bridge method. According to the manufacturing method, a traditional one-time resistance welding manufacturing process is changed, a two-time resistance welding manufacturing process is adopted, and the first-time resistance welding manufacturing process aims at filling and leveling up the base material between the circuits and ensuring that the circuit does not become red when the ink thickness is reduced for the second time. That is, on the premise that the solder resist quality is met, the thickness of the second solder resist ink is reduced, the lateral erosion amount during solder resist development is reduced, a stable and reliable solder resist bridge with high compactness is obtained, an overall reliable solder resist layer is further obtained, and it is ensured that tin connection short circuit does not occur in the welding process.

Description

Technical field [0001] The present invention belongs to the technical field of soft and hard bond board processing, and is specifically a method of high precision fine barrier bridge. Background technique [0002] The presence of the solder welding as the protective layer of the line, the effective protection line copper is not corroded, and the patch does not short-circuit due to foreign matter or electrolytic solutions, widely used in the field of circuit board manufacturing. [0003] The existing soldering bridge production method is a direct production method. After the welding ink is pressed, it is performed, then the development, produce the needed barrier bridge, and ensure that the soldering bridge can guarantee that no welding does not Short circuit between the inter-disc. [0004] As electronic devices are getting more precipitating, the requirements for PCB are also increasingly high, and PCB lines are getting finer. At the same time, with the development of the packag...

Claims

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Application Information

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IPC IPC(8): H05K3/28
CPCH05K3/282
Inventor 刘鹍李晓雷熊俊杰刘期刚郎广志
Owner 广德今腾电子科技有限公司