Carrying robot

Abstract

The transfer robot comprises a base, a lower arm and an upper arm which are rotationally connected in sequence, an executing mechanism is rotationally arranged on the upper arm, a wire harness is arranged in a driving module of the executing mechanism, and meanwhile the wire harness can extend to the inner space of a lower wrist and the inner space of an upper wrist. And electronic components of the lower end executor and the upper end executor are respectively connected through wire harnesses. The wire harness is arranged in the driving module, so that the reciprocating motion of the wire harness is avoided, the performance requirement on the wire harness can be reduced, and the cost is saved; meanwhile, the abrasion of the robot to the wire harness in the wafer carrying process is reduced, the generation of dust is inhibited, and the manpower and material cost generated by later maintenance and wire harness replacement is also reduced; the structure is greatly simplified, the assembling difficulty and the assembling time are reduced, the machining difficulty and the material cost are also reduced, the later maintenance time can be shortened through the simple structure, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a handling robot for wafer delivery. Background technique [0002] An integrated circuit (integrated circuit) is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected together, fabricated on a small or several small semiconductor chips, and then packaged in a tube shell to become a circuit with The microstructure of the required circuit function; all the components have been formed into a whole in the structure, which makes the electronic components take a big step towards miniaturization, low power consumption, intelligence and high reliability. It is represented by the letter "IC" in the circuit. [0003] The basis of an integrated circuit is a semiconductor chip, also known as a wafer. In the manufacturing process of integrated circuits, high p...

AI Technical Summary

Problems solved by technology

[0005] In addition, the cables and air pipes in the moving part need to have excellent wear resistance, which increases the cost of raw materials; during the installation process, due to the winding of wire harnesses in a small space, this design also increases labor costs and later maintenance costs

[0006] Therefore, the current handling robot has an unreasonable wiring harness setting position, which leads to increased difficulty in early assembly, increased performance requirements for parts, faster wear and tear of the later wiring harness, increased maintenance times, increased maintenance costs, and reduced production efficiency.

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