Manifold micro-column array flat plate heat exchanger

A technology of microcolumn array and heat exchanger, which is applied in the field of heat pipe of F28d15/02, can solve the main problems such as limited effect and unrealized optimization of manifold microchannel structure, so as to improve heat dissipation performance, strengthen overall heat transfer, improve The effect of uniformity

Active Publication Date: 2022-03-04
SHANDONG UNIV
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  • Abstract
  • Description
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Problems solved by technology

However, neither of these two patents has realized the structural optimization of the manifold microchannel, which has limited effect on solving its main problems.

Method used

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  • Manifold micro-column array flat plate heat exchanger
  • Manifold micro-column array flat plate heat exchanger
  • Manifold micro-column array flat plate heat exchanger

Examples

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Embodiment Construction

[0033] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0034] Figure 1-8 Disclosed is a manifold microcolumn array plate heat exchanger. Such as figure 1 As shown, the manifold microcolumn array flat plate heat exchanger is provided with fluid inlet and outlet layer 1, manifold diversion layer 2 and microcolumn array layer 3 in sequence from top to bottom, and the three-layer structure is combined to form a complete manifold microcolumn array heat exchanger. heater.

[0035] Such as figure 1 , 2 As shown, the fluid inlet and outlet layer 1 includes an upper face and a lower face, the upper face is provided with a fluid inlet 11 and a fluid outlet 14, the lower face is provided with a fluid inlet channel 12 and a fluid outlet channel 13, and the fluid inlet 11 It communicates with the fluid inlet channel 12, and the fluid outlet 14 communicates with the fluid outlet channel 13. The fluid ...

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Abstract

The manifold micro-column array flat plate heat exchanger is sequentially provided with a fluid inlet and outlet layer, a manifold flow dividing layer and a micro-column array layer from top to bottom, the fluid inlet and outlet layer comprises an upper face and a lower face, a fluid inlet and a fluid outlet are formed in the upper face, and a fluid inlet runner and a fluid outlet runner are arranged on the lower face. The fluid inlet is communicated with the fluid inlet runner, the fluid outlet is communicated with the fluid outlet runner, the fluid inlet runner is arranged at the first end of the lower surface and extends along the first end in the first direction, and the fluid outlet runner is arranged in the middle of the lower surface and extends in the direction perpendicular to the fluid inlet runner. According to the flat plate heat exchanger, microminiaturization can be achieved, the number of the inlet manifold inflow channels is two, the number of the inlet manifold inflow channels is two, then the fluid impacts in the inlet manifold, impact of the fluid on the microcolumn array layer can be strengthened, and the overall heat dissipation performance is improved.

Description

technical field [0001] The invention relates to a heat exchanger technology, in particular to a flat plate heat exchanger, which belongs to the heat pipe field of F28d15 / 02. Background technique [0002] A heat exchanger is a device that exchanges heat between hot and cold fluids, also known as a heat exchanger. Heat exchangers are widely used in many fields. In fields such as electronics, petrochemicals, communications, aerospace and other fields, due to their special working scenarios, there are special requirements for the size and weight of the heat exchanger, and it is required to have a stronger heat exchange capacity. [0003] In 1981, some scholars proposed the use of microchannels for heat dissipation, which can not only reduce the volume of the heat exchanger, but also greatly increase its heat transfer capacity by using the higher specific surface area of ​​the microchannels. However, although its heat exchange capacity is strong, the overall pressure loss of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/00
CPCF28D15/00
Inventor 辛公明高维陈岩
Owner SHANDONG UNIV
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