Integrated circuit packaging structure and assembling method thereof

Abstract

The invention discloses an integrated circuit packaging structure and an assembling method thereof. The integrated circuit packaging structure comprises a metal shell (1), and a stepped opening (11) is formed in an opening groove (12) of the metal shell; the metal insulator (2) comprises a nano ceramic aluminum alloy substrate (21) provided with a group of mounting through holes (22), the edge of the outer contour of the metal insulator is provided with a step opening (23), the shape of the step opening (23) is matched with that of the step opening, the surface of the nano ceramic aluminum alloy substrate is connected with an insulating layer (24) of triple-structure aluminum oxide, and the surface of the step opening and the insulating layer on the inner walls of the mounting through holes are connected with a metalized layer (25); a group of pins (3), each pin is provided with a flange (31), and each pin is hermetically welded with the metal insulator through the flange and the metalized layer on the inner wall of the mounting through hole; the step openings are connected with each other, and the metal shell is hermetically welded with the metal insulator; and the shell and the PCB (4) are assembled by adopting a radial welding method. According to the invention, the high impact resistance of the hybrid integrated circuit during use can be improved.

Description

Technical field [0001] The present invention relates to the field of mixing integrated circuit technology, and more particularly to an integrated circuit package structure and a assembly method thereof. Background technique [0002] A typical package form of a mixed integrated circuit is a metal housing package. Specifically, the film forming substrate of the circuit is first produced, and then the assembly interconnection of various components on the substrate is usually assembled with bonding (or welding). On the metal housing, a bonding manner is used to achieve an electrical connection between the substrate and the package outer lead of the outer casing. Among them, a conventional metal housing package is figure 1 As shown: The encapsulating outer lead A1 is sintered between the glass insulator A3 between the outer casing base A2, and the glass insulator A3 acts as an insulation between the outer lead and the metal casing; on the other hand, it is sealed to maintain the entir...

AI Technical Summary

Problems solved by technology

A main problem of this conventional metal shell package is that the brittleness of the glass insulator a3 directly leads to its low strength, especially under the action of high-strength mechanical impact, the circuit glass insulator a3 assembled on the circuit board is prone to breakage Cracks, such broken particles will form movable residues inside the circuit and directly cause product performance and quality problems

[0005] However, in the face of higher requirements for shock resistance and vibration resistance, as well as heat dissipation requirements for power circuits and high reliability requirements, there are still the following problems in the use of ceramic strip structures: First, although the local strength of the outer leads is higher than that of the original glass material, However, compared with the original metal structure, the overall strength and toughness of the ceramic strip body itself has decreased, and the brittleness has increased significantly. Under higher mechanical shock and vibration environments, the ceramic strip body is prone to cracks or even fragmentation; the second , the use of ceramic strips as a whole to replace the metal part of the original shell will directly lead to a decrease in heat dissipation performance, which is not conducive to the use of high-power circuits; A split structure is formed between the shells. Under the action of high impact overload in the Y1 direction, there are relative separations between the circuit metal shell structure and the ceramic strip body installed on the PCB, and between the ceramic strip body and the outer lead. trend, leading to the interface between the ceramic strip body and the metal shell, the interface between the outer lead and the ceramic strip body, all bear a large impact stress, and there is a hidden danger of cracks or even loosening at the interface; Fourth, the side of the ceramic strip body and the metal shell Body welding assembly, welding and assembly of each outer lead and ceramic strip body, involving many welding positions, as long as there is a leak in one place, it will cause the airtightness of the entire circuit. At present, the overall sealing yield of this packaging structure is low.

The problem with this assembly method is that the solder is only soldered at the end of the outer lead. Usually, the solder only partially fills the metallized hole near the back of the PCB, and the metallized hole near the front of the PCB lacks solder filling, which is difficult to ensure Solder fully fills the gap between the outer lead and the hole wall in the metallized hole of the PCB, and it is more difficult to ensure that the solder crosses the through hole from the back of the PCB to the front of the PCB, so as to achieve reliable welding of the root of the outer lead at the through hole on the front of the PCB

As a result, although the end of the outer lead is welded and assembled at the through hole on the back of the PCB, the root of the outer lead close to the front of the PCB is still in a suspended state, and the root of the outer lead lacks fixed support on the front of the PCB. Under the action of shock and vibration, the entire circuit will vibrate significantly, which will have a negative impact on the stability of the entire circuit structure, and the root of the outer lead will also be subjected to obvious transverse shear force, which may even cause the outer lead of the package to break

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