CMP eddy current end point detection device
A technology of endpoint detection and eddy current, applied in the direction of grinding equipment, grinding machine tools, metal processing equipment, etc., can solve the problems of lack of simplicity
Active Publication Date: 2022-03-08
北京晶亦精微科技股份有限公司
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Problems solved by technology
[0005]
Therefore, the technical problem to be solved by the present invention is to overcome the lack of simple, reliable, and medium-independent conductive film thickness measuring devices in the prior art, thereby providing a CMP eddy current endpoint detection device
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[0027] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0028] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...
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The invention provides a CMP eddy current end point detection device, which comprises a resonance circuit, a sampling circuit and an eddy current detection communication controller, and is characterized in that the resonance circuit comprises an eddy current sensor, a capacitor and equivalent apparent impedance of the eddy current sensor and a wafer conductive film during coil resonance and mutual inductance of the eddy current sensor; the eddy current detection communication controller controls the eddy current sensor to generate an alternating magnetic field, so that a conductive film in a to-be-polished wafer substrate generates an induced eddy current, and the output power of the eddy current sensor is consumed; the sampling circuit is used for collecting supplementary current input into the eddy current sensor and sending the collected supplementary current to the eddy current detection communication controller, the eddy current detection communication controller fits a relation coefficient between supplementary power and apparent impedance according to the supplementary current, and then the thickness of a conductive film in a wafer substrate to be polished is worked out. According to the invention, the conductive film thickness measuring device is simplified, and the reliability of the conductive film thickness measuring device is improved.
Description
technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a CMP eddy current endpoint detection device. Background technique [0002] In the integrated circuit manufacturing process, after the conductive film of the wafer substrate is deposited, it is processed by a chemical mechanical polishing (CMP) process, which can effectively improve the overlay accuracy of the photolithography process. Therefore, the thickness of the conductive film needs to be monitored in real time during the chemical mechanical polishing process, and the grinding is stopped at a predetermined thickness value. [0003] At present, the detection methods for real-time monitoring of chemical mechanical polishing machines include light detection, eddy current phase difference and amplitude difference detection and other detection methods. Among them, the light detection sensitivity is high, but it can only be used to determine the end poin...
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Login to View More IPC IPC(8): B24B37/005B24B37/013B24B49/10
CPCB24B37/013B24B37/005B24B49/105
Inventor 李坤李婷张康张为强
Owner 北京晶亦精微科技股份有限公司