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Thermoelectric device and cooling fin integrated thermoelectric assembly

A technology of thermoelectric devices and thermoelectric components, applied in thermoelectric device components, thermoelectric devices, electric solid devices, etc., can solve the problems of reducing thermoelectric performance and production efficiency of thermoelectric components, increasing production costs, difficult to control torque, etc., to improve production Efficiency, Avoidance of Production Cost, Effect of Elimination of Thermal Resistance

Pending Publication Date: 2022-03-08
金川集团铜业有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the one hand, experienced assembly increases the production cost. On the other hand, when the operator is not skilled, it is difficult to control the torque during assembly, which will easily lead to the breakage of the ceramic substrate or thermoelectric material grains in the thermoelectric device, reducing the quality of the thermoelectric component. Thermoelectric performance and production efficiency

Method used

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  • Thermoelectric device and cooling fin integrated thermoelectric assembly
  • Thermoelectric device and cooling fin integrated thermoelectric assembly
  • Thermoelectric device and cooling fin integrated thermoelectric assembly

Examples

Experimental program
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Effect test

Embodiment 1

[0027] Such as figure 2 As shown, in embodiment 1, the thermoelectric assembly in which the thermoelectric device and heat sink of the present invention are integrated includes a first ceramic substrate 1, a second ceramic substrate 2, and thermoelectric material grains 3; the first ceramic substrate 1 is welded with The first guide sheet 4, the second guide sheet 5 is welded on the second ceramic substrate 2, the thermoelectric material grain 3 is welded on the first guide sheet 4 at one end, and welded on the other end. On the second guide plate 5; the second ceramic substrate 2 in the first ceramic substrate 1 and the second ceramic substrate 2 is a ceramic substrate with fins, and the ceramic substrate with fins includes integrally formed Ceramic base 6 and cooling fins 7. Wherein, the thermoelectric device may be a thermoelectric refrigeration device or a thermoelectric power generation device. In Embodiment 1, the thermoelectric device is a thermoelectric refrigeratio...

Embodiment 2

[0041] Such as image 3 As shown, the difference between this embodiment 2 and the embodiment 1 lies in that both the first ceramic substrate 1 and the second ceramic substrate 2 are ceramic substrates with fins.

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Abstract

The invention relates to the technical field of thermoelectric assemblies, and provides a thermoelectric device and cooling fin integrated thermoelectric assembly, which comprises a first ceramic substrate, a second ceramic substrate and thermoelectric material crystal grains, a first flow deflector is welded on the first ceramic substrate, a second flow deflector is welded on the second ceramic substrate, one end of the thermoelectric material crystal grain is welded on the first flow deflector, and the other end of the thermoelectric material crystal grain is welded on the second flow deflector; at least one of the first ceramic substrate and the second ceramic substrate is a ceramic substrate with fins, and the ceramic substrate with the fins comprises a ceramic base and radiating fins which are integrally formed. The conversion efficiency of the thermoelectric assembly can be improved, the production cost of the thermoelectric assembly is reduced, and the production efficiency of the thermoelectric assembly is improved.

Description

technical field [0001] The invention relates to the technical field of thermoelectric components, in particular to a thermoelectric component in which a thermoelectric device and a cooling fin are integrated. Background technique [0002] At present, in the thermoelectric device industry, traditional thermoelectric components are component structures in which thermoelectric devices and heat sinks are independently manufactured and then assembled together. Such as figure 1 As shown, the traditional thermoelectric device is formed by welding thermoelectric material grains 3 and two thin ceramic substrates, that is, the first ceramic substrate 1 and the second ceramic substrate 2, and the heat sink 9 is made of aluminum or copper material. become. [0003] When used, thermoelectric devices must be bonded to metal heat sinks with thermal grease, thermal pads, phase change materials, graphite sheets, and fasteners. This creates an interface between the thermoelectric device an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L35/02H01L35/32H10N10/17H10N10/80
CPCH01L23/3672H10N10/80H10N19/101H10N10/17
Inventor 韩文林曹茜张燕赵彦才
Owner 金川集团铜业有限公司
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