Circuit board assembly, electronic equipment and manufacturing method of circuit board assembly
A technology of circuit board assembly and manufacturing method, which is applied in the manufacture of electronic equipment and circuit board assembly, and the field of circuit board assembly, can solve problems such as chip cracking
Pending Publication Date: 2022-03-08
HUAWEI TECH CO LTD
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, during the welding process of the chip and the substrate, the thermal expansion and deformation of the substrate exerts a force on the connected metal pillars, and the force is transmitted to the chip along the metal pillars, which may easily cause the chip to crack
Method used
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[0069]In order to better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.
[0070] It should be clear that the described embodiments are only a part of the embodiments of the present application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
[0071] In a specific embodiment, the present application will be further described in detail below through a specific embodiment and in conjunction with the accompanying drawings.
[0072] Such as Figure 1A , Figure 1B and Figure 1C Shown is a connection structure between a chip and a circuit board. Specifically, the chip 11' is connected to the substrate 12' of the circuit board through a metal post 13', and there is solder between the metal post 13...
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The invention relates to the technical field of electronic equipment, in particular to a circuit board assembly, electronic equipment and a manufacturing method of the circuit board assembly. The circuit board assembly comprises a chip, a substrate and a metal column. The metal column is arranged between the chip and the substrate, the metal column comprises a first end face and a second end face, the first end face is connected with the chip, and the second end face is connected with the substrate; the metal column comprises a buffer part, the buffer part is arranged between the first end face and the second end face, the cross sectional area of the buffer part is smaller than that of the first end face and smaller than that of the second end face, and the buffer part can reduce stress borne by the joint of the metal column and the substrate. Therefore, the risk that the joint of the substrate and the metal column is cracked under the action of stress can be reduced, and the connection reliability of the substrate and the metal column is improved.
Description
technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a circuit board assembly, electronic equipment and a manufacturing method of the circuit board assembly. Background technique [0002] Driven by the high speed, high performance and miniaturization of electronic products, integrated circuits are developing towards high density and miniaturization. In the prior art circuit board, the chip and the substrate are connected by solder balls, and the solder balls are heated, melted and flowed to cause the solder joints to collapse. After the solder joints collapse, the distance between adjacent solder joints decreases. At this time, each solder joint on the circuit board prone to short circuits. Therefore, during small-pitch soldering, metal pillars and part of the solder are used to replace the solder balls. The metal pillars act as supports to prevent the chip from collapsing during the soldering process. The s...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K1/02H05K1/18H05K3/00H05K3/02
CPCH05K1/02H05K1/184H05K3/0082H05K3/027H05K2201/095H05K2203/04
Inventor 叶润清张立马会财佘勇吕秀启
Owner HUAWEI TECH CO LTD