Energy-saving high-precision BGA chip tin removing machine for intelligent welding system

A welding system and energy-saving technology, applied in welding equipment, auxiliary devices, manufacturing tools, etc., can solve the problems of difficult cleaning, difficult cleaning, increased chip damage and collection difficulty, etc., to improve the precision and efficiency of tin removal and improve efficiency. Sexual and comprehensive, avoiding the effect of rapid heat loss
CN114160902AActive Publication Date: 2022-03-11深圳市维佳芯片返修科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
深圳市维佳芯片返修科技有限公司
Publication Date
2022-03-11

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Abstract

The energy-saving high-precision BGA chip tin removing machine for the intelligent welding system comprises a platform, an electric push rod is arranged in the middle of one side of the top of the platform, a mounting frame is arranged at the output end of the electric push rod, and a tin removing guide groove is formed in the middle of the top of the platform; one end of the back surface of the tin removal guide groove is provided with a row guide groove which is communicated with the tin removal guide groove, and the row guide groove and the tin removal guide groove form an L-shaped structure; according to the invention, the tin removal guide groove and the row guide groove are matched to form the L-shaped groove body, and the material guide device is arranged at the port of the tin removal guide groove to guide the chip entering the groove, so that the chip can enter the groove of the tin removal guide groove more orderly and smoothly for tin removal; and meanwhile, the first brush roller and the second brush roller which are crisscrossed are arranged at the tail end of the tin removal guide groove and the front end of the row guide groove correspondingly, secondary brushing work of different faces is conducted on the guided-in chip, and the tin removal precision and efficiency of the chip are greatly improved.
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Description

technical field

[0001] The invention relates to the technical field of chip processing, in particular to an energy-saving high-precision BGA chip tin remover for an intelligent welding system. Background technique

[0002] BGA is ball grid array packaging technology. The emergence of this technology has become the best choice for high-density, high-performance, multi-pin packaging such as CPU, motherboard south and north bridge chips. However, BGA packaging occupies a relatively large area of ​​the substrate. Although this technology The number of I / O pins increases, but the distance between the pins is large, thereby improving the assembly yield, and the technology uses a controlled collapse chip welding method, which can improve its electrothermal performance. The existing BGA chip , After the processing is completed, it is necessary to clean up the excess tin on the surface of the BGA chip.

[0003] When removing tin from a BGA chip, the chip is generally transported int...

Claims

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