Energy-saving high-precision BGA chip tin removing machine for intelligent welding system

Abstract

The energy-saving high-precision BGA chip tin removing machine for the intelligent welding system comprises a platform, an electric push rod is arranged in the middle of one side of the top of the platform, a mounting frame is arranged at the output end of the electric push rod, and a tin removing guide groove is formed in the middle of the top of the platform; one end of the back surface of the tin removal guide groove is provided with a row guide groove which is communicated with the tin removal guide groove, and the row guide groove and the tin removal guide groove form an L-shaped structure; according to the invention, the tin removal guide groove and the row guide groove are matched to form the L-shaped groove body, and the material guide device is arranged at the port of the tin removal guide groove to guide the chip entering the groove, so that the chip can enter the groove of the tin removal guide groove more orderly and smoothly for tin removal; and meanwhile, the first brush roller and the second brush roller which are crisscrossed are arranged at the tail end of the tin removal guide groove and the front end of the row guide groove correspondingly, secondary brushing work of different faces is conducted on the guided-in chip, and the tin removal precision and efficiency of the chip are greatly improved.

Description

technical field [0001] The invention relates to the technical field of chip processing, in particular to an energy-saving high-precision BGA chip tin remover for an intelligent welding system. Background technique [0002] BGA is ball grid array packaging technology. The emergence of this technology has become the best choice for high-density, high-performance, multi-pin packaging such as CPU, motherboard south and north bridge chips. However, BGA packaging occupies a relatively large area of ​​the substrate. Although this technology The number of I / O pins increases, but the distance between the pins is large, thereby improving the assembly yield, and the technology uses a controlled collapse chip welding method, which can improve its electrothermal performance. The existing BGA chip , After the processing is completed, it is necessary to clean up the excess tin on the surface of the BGA chip. [0003] When removing tin from a BGA chip, the chip is generally transported int...

AI Technical Summary

Problems solved by technology

[0003] When removing tin from a BGA chip, the chip is generally transported into the groove, and the tin is removed with a brush. However, when the chip is introduced into the groove, it is difficult to push it into the groove smoothly, and operators often need to Take the tool and put the chip tweezers into the groove, the operation process is cumbersome and inconvenient, and when the chip in the groove is in contact with the brush, the thrust generated by the rotation of the brush will cause the chip to fly out of the groove, increasing the impact on the chip Difficulty in damage and collection. It is difficult to completely remove the excess tin sheet on the chip surface by one brushing, and remove the generated tin slag, which is easy to remain in the groove and is difficult to clean, reducing the work efficiency of chip tin removal

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