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Die bonding glue dispensing head, die bonding method and LED device

A dispensing head and LED chip technology, applied in the electronic field, can solve problems such as low die-bonding yield, solder paste voids, solder paste overflow, etc., and achieve the effect of improving die-bonding yield and reducing void rate

Pending Publication Date: 2022-03-18
WUHU JUFEI PHOTOELECTRIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main technical problem to be solved by the die-bonding dispensing head, the die-bonding method and the LED device provided by the embodiments of the present invention is that the cross-section of the dispensing head used for die-bonding is circular at present, and it is easy to There is a problem that the solder paste overflows the pad in one direction, but there is a void in the solder paste in the other direction, resulting in a problem of low die-bonding yield

Method used

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  • Die bonding glue dispensing head, die bonding method and LED device
  • Die bonding glue dispensing head, die bonding method and LED device
  • Die bonding glue dispensing head, die bonding method and LED device

Examples

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Embodiment 1

[0046] In the process of bonding the LED chip to the bracket, usually the die-bonding machine is used to control the die-bonding dispensing head to dip the solder paste from the solder paste tray, and then put the solder paste on the pad in the bracket, and then the die-bonding machine Afterwards, reflow soldering is carried out, so that the chip electrode of the LED chip and the pad of the bracket are welded together by solder paste. However, the cross section of the dispensing head is usually circular. By selecting the appropriate size tip, it is easy to ensure that the shape and size of the solder paste deposited on the pad will match the shape and size of the pad, see for example Figure 1a A schematic diagram of the arrangement of the solder paste 12 on the pad 11 of the bracket 10 is shown. However, if the pad 11 is in the shape of a long and thin strip, it is impossible to select a needle of a suitable size. In this case, the problem of a large void rate of the solder pa...

Embodiment 2

[0067] This embodiment provides a crystal-bonding method. In this crystal-bonding method, the crystal-bonding material can be set on the chip electrode or the support pad by using the crystal-bonding dispensing head provided in any of the preceding examples:

[0068] In some examples of this embodiment, the crystal-bonding material used in the crystal-bonding process includes at least one of a bonding material and an auxiliary bonding material, and in some examples, both the bonding material and the bonding auxiliary material are included. During the die-bonding process, both types of die-bonding materials can be set using the die-bonding dispensing head provided in any of the preceding examples. In some examples of this embodiment, the die-bonding head provided in the preceding examples can be used first The dispensing head sets the bonding material on the support pad, and then uses the die-bonding head to set the auxiliary bonding material on the support pad; in some examples...

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Abstract

According to the die bonding dispensing head, the die bonding method and the LED device provided by the embodiment of the invention, the sizes of the cross section of the free end of the needle head in the die bonding dispensing head in the two mutually perpendicular directions are set to be different, so that the length-width ratio of the cross section of the needle head is greater than 1, and the needle head can dispense a long-strip-shaped die bonding material; therefore, the die bonding pad and the chip electrode with a certain length-width ratio can be better adapted, the voidage of the die bonding material is reduced, the problem that the die bonding material overflows out of the boundary of the chip electrode and the bonding pad is avoided, and the die bonding yield is improved.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a crystal-bonding dispensing head, a crystal-bonding method and an LED device. Background technique [0002] When solidifying LED chips, the solder paste is usually dipped in the dispensing head used for solid crystal, and placed on the pads of the bracket. After the LED chip is bonded to the bracket and undergoes reflow soldering, the LED chip and the bracket are completed. Fixed connection and electrical connection. However, at present, the cross-section of the needle of the dispensing head is basically circular, and the solder paste dispensed is also circular. In order to reduce the solder paste void after reflow soldering (that is, there is no solder paste in some areas between the chip electrode and the pad, The two are relatively suspended), the diameter of the cross-section of the dispensing head will be set as large as possible, which will cause the solder paste to e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/48H01L33/62H01L2933/0033H01L2933/0066
Inventor 胡永恒袁诚陈伟肖平陈潮平郝玉凤刘丽黄业柱黄庆进丘海堂
Owner WUHU JUFEI PHOTOELECTRIC TECH CO LTD