Microneedle for nerve interface
A technology of microneedle and interface, applied in the field of microneedle of neural interface, can solve problems such as single function, inability to realize three-dimensional collection of neuron discharge information in gray matter layer, and few electrode recording points, so as to improve spatial resolution and signal accuracy degree of effect
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Embodiment 1
[0029] refer to figure 1 , the present embodiment provides a microneedle for a neural interface, at least two body electrodes 1, wherein at least two body electrodes 1 have unequal lengths, and the at least two body electrodes 1 extend along the tail of the microneedle direction arrangement.
[0030] In actual scenarios, the body electrodes of the microneedles used for neural interfaces have been designed with different lengths according to the application scenarios when they leave the factory, or the lengths of the body electrodes of the microneedles used for neural interfaces are equal when they leave the factory. , in actual use, the body electrodes are cut according to the implantation data to obtain microneedles with different lengths. Wherein, the body electrode may be trimmed by laser cutting, or by other methods, which are not specifically limited here. Wherein, the implantation data may be the data obtained according to the pre-established model, or may be the real-...
Embodiment 2
[0039] combine figure 1 with figure 2 , the present embodiment provides a microneedle for a neural interface, comprising: at least one microneedle assembly, the microneedle assembly includes a microneedle body and an integrated circuit chip, the integrated circuit chip is arranged at the tail of the microneedle body, The microneedles include the body electrodes. The microneedle includes: a binding device, the binding device is used to integrate at least two microneedle assemblies. Both ends of the tail of the microneedles are provided with through holes, and the restraint device includes a connecting rod, and the connecting rod passes through the through hole on the same side of the tail of each microneedle.
[0040]Specifically, the microneedle assembly includes a microneedle body and at least one integrated circuit chip 4; the microneedle body is bonded with the integrated circuit chip 4 to form a microneedle assembly (such as figure 1 As shown), multiple groups of micro...
Embodiment 3
[0058] In order to further illustrate the present invention, Embodiment 2 of the present invention also discloses a method for preparing a microneedle for a neural interface, including steps:
[0059] S1. Using standard MEMS processing technology to produce microneedles;
[0060] S2. Processing at least one body electrode point on the microneedle body;
[0061] S3. Implanting indium pillars on the microneedle body and the integrated circuit chip respectively;
[0062] S4, bonding the microneedle body implanted with the indium column and the integrated circuit chip to form a microneedle assembly;
[0063] S5. Processing two through holes respectively at both ends of at least one microneedle assembly for penetrating connecting rods, and assembling the microneedles for nerve interface in a matrix structure.
[0064] Specifically, the MEMS processing technology in the step S1 specifically adopts SOI to manufacture and process the microneedle structure.
[0065] Specifically, th...
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