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High-precision integrated circuit chip packaging device and packaging process thereof

An integrated circuit and chip packaging technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of low chip bonding stability, increased manufacturing costs, no seismic performance and high heat dissipation, etc. The effect of light curing efficiency, improving packaging efficiency and shortening light curing time

Active Publication Date: 2022-03-22
江苏高格芯微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual packaging process, especially in the packaging process of high-precision integrated circuit chips, due to the low stability of chip bonding, it is easy to cause chip peeling and dislocation during the process of packaging with resin, which will affect the semiconductor stack. The stability of the packaging structure leads to an increase in manufacturing costs. At the same time, the existing packaging devices do not have shock resistance and high heat dissipation, and cannot effectively protect high-precision integrated circuit chips.

Method used

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  • High-precision integrated circuit chip packaging device and packaging process thereof
  • High-precision integrated circuit chip packaging device and packaging process thereof
  • High-precision integrated circuit chip packaging device and packaging process thereof

Examples

Experimental program
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Embodiment 1

[0045] see Figure 1-Figure 10 , a high-precision integrated circuit chip packaging device, including an upper case 1, a lower case 3 and a liner 2, a chip 4 is fixed on the liner 2, and the opposite sides of the upper case 1 and the lower case 3 are A second light guide frame 5 is provided, the inside and outside of the frame of the second light guide frame 5 are provided with gluing grooves 7, and the second light guide frame 5 of the upper housing 1 is provided with a mating block 13, four mating blocks 13 The blocks 13 are equally arranged at equal angles, the top of the matching block 13 extends through the upper casing 1 and is fixed with the first light guide frame 12, and the second light guiding frame 5 of the lower casing 3 is provided with a matching The mating groove 32 that matches the block 13 is provided with an elastic capsule 14 in the mating block 13, and the elastic capsule 14 is saturated and filled with light-curing glue 9, and the bottom of the elastic ca...

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PUM

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Abstract

The high-precision integrated circuit chip packaging device comprises an upper shell, a lower shell and a lining plate, a chip is fixed to the lining plate, the opposite sides of the upper shell and the lower shell are each provided with a second light guide frame, the inner side and the outer side of a frame body of each second light guide frame are each provided with a gluing groove, and the gluing grooves are formed in the inner side and the outer side of the frame body of each second light guide frame. The second light guide frame of the upper shell is provided with four folding blocks, the four folding blocks are evenly distributed at equal angles, the top ends of the folding blocks extend to penetrate through the upper shell and are fixedly provided with a first light guide frame, and the second light guide frame of the lower shell is provided with folding grooves matched with the folding blocks. And the packaging structure can be completely disassembled after being packaged, is convenient to maintain and reuse, is simple in process, effectively reduces the manufacturing cost, has market prospects and is suitable for popularization.

Description

technical field [0001] The invention relates to the field of chip packaging, more specifically, to a high-precision integrated circuit chip packaging device and a packaging process thereof. Background technique [0002] In the existing semiconductor stack packaging technology, usually an adhesive material is directly arranged between the chips to complete the bonding, and then the bonded chip package is packaged with a resin material. However, in the actual packaging process, especially in the packaging process of high-precision integrated circuit chips, due to the low stability of chip bonding, it is easy to cause chip peeling and dislocation during the process of packaging with resin, which will affect the semiconductor stack. The stability of the packaging structure leads to an increase in manufacturing costs. At the same time, the existing packaging devices do not have shock resistance and high heat dissipation, and cannot effectively protect high-precision integrated ci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/02H01L23/10H01L23/16H01L23/367H01L23/427F16F15/04H01L21/52
CPCH01L23/02H01L23/10H01L23/16H01L23/3672H01L23/427F16F15/04H01L21/52
Inventor 魏永红魏霄鸿马吉祥王国霖李星星
Owner 江苏高格芯微电子有限公司
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