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Adhesive for halogen-free high-Tg yellowing-resistant copper-clad plate applicable to field of LED (light-emitting diode) packaging as well as preparation method and application of adhesive

A LED packaging and anti-yellowing technology, applied in the direction of non-polymer adhesive additives, adhesive types, adhesives, etc., can solve the problem of decreased light reflectivity, reduced LED efficiency and service life, and increased heat generation of LED components And other issues

Active Publication Date: 2022-03-25
南亚新材料科技(江西)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the development of high-brightness LED technology, LEDs have become more bright, and at the same time, the heat generation of LED components has increased. In the past, the substrate used to carry LED components due to high heat radiation caused the color of the substrate to age and turn yellow, thus During continuous use, it is easy to reduce the reflectivity of light, which reduces the LED performance and service life

Method used

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  • Adhesive for halogen-free high-Tg yellowing-resistant copper-clad plate applicable to field of LED (light-emitting diode) packaging as well as preparation method and application of adhesive

Examples

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Effect test

Embodiment 1

[0042] Dissolve 20g of anhydride curing agent in a beaker (this example uses EF30) using an organic solvent (this example uses MEK), add 30g of anti-yellowing resin (this example uses aliphatic epoxy 821E), 5g of general-purpose double A type Epoxy resin (this embodiment uses Zhinanya 128), 0.05g accelerator (this embodiment uses 2E4MZ), 0.15g fluorescent whitening agent (this embodiment uses OB-1), and after stirring for one hour, add 50g titanium dioxide, 10g Silica, a white resin composition was obtained after dispersing in a high-speed disperser for 1 hour.

[0043] Prepregs were prepared by impregnating electronic-grade glass fiber cloth and baked at 170°C for 3 minutes. Six sheets of the above-mentioned prepregs were laminated with an electrolytic copper sheet on each side to form a laminate. The curing process was as follows: the heating rate was 1.5°C / min, the pressing point is controlled between 80-110°C, the curing is above 200°C above 90mim, and the total pressure ...

Embodiment 2

[0045] Dissolve 20g of anhydride curing agent in a beaker (this example uses EF30) using an organic solvent (this example uses MEK), add 30g of anti-yellowing resin (this example uses aliphatic epoxy 821E), 10g of general-purpose double A type Epoxy resin (this embodiment uses Zhinanya 128), 0.05g accelerator (this embodiment uses 2E4MZ) and after stirring for one hour, add 50g titanium dioxide, 10g silicon dioxide, 0.15g fluorescent whitening agent (this embodiment uses OB -1), a white resin composition was obtained after being dispersed by a high-speed disperser for 1 hour.

[0046] Prepregs were prepared by impregnating electronic-grade glass fiber cloth and baked at 170°C for 3 minutes. Six sheets of the above-mentioned prepregs were laminated with an electrolytic copper sheet on each side to form a laminate. The curing process was as follows: the heating rate was 1.5°C / min, the pressing point is controlled between 80-110°C, the curing is above 200°C above 90mim, and the ...

Embodiment 3

[0048] Dissolve 20g of anhydride curing agent in a beaker (this example uses EF30) using an organic solvent (this example uses MEK), add 30g of anti-yellowing resin (this example uses aliphatic epoxy 821E), 15g of general-purpose double A type Epoxy resin (this embodiment uses Zhinanya 128), 0.05g accelerator (this embodiment uses 2E4MZ), 0.15g fluorescent whitening agent (this embodiment uses OB-1), and after stirring for one hour, add 50g titanium dioxide, 10g Silica, a white resin composition was obtained after dispersing in a high-speed disperser for 1 hour.

[0049] Prepregs were prepared by impregnating electronic-grade glass fiber cloth and baked at 170°C for 3 minutes. Six sheets of the above-mentioned prepregs were laminated with an electrolytic copper sheet on each side to form a laminate. The curing process was as follows: the heating rate was 1.5°C / min, the pressing point is controlled between 80-110°C, the curing is above 200°C above 90mim, and the total pressure...

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Abstract

The invention discloses an adhesive for a halogen-free high-Tg yellowing-resistant copper-clad plate, which is applicable to the field of LED (light-emitting diode) packaging and comprises the following components in parts by weight: 30-80 parts of yellowing-resistant resin; 10-50 parts of basic epoxy resin; 10-60 parts of an anhydride curing agent; 0.01 to 5 parts of an accelerant; 10-80 parts of a first inorganic filler; 10-40 parts of a second inorganic filler; the invention also discloses a preparation method of the fluorescent whitening agent. The invention also discloses a preparation method and application of the compound. The halogen-free high-Tg yellowing-resistant copper-clad plate prepared by the invention does not yellow at a high temperature (such as 180 DEG C), the light reflectivity is not attenuated, and Tg is greater than 230 DEG C (DMA); and the Z-axis CTE is less than 1.8%.

Description

technical field [0001] The invention relates to the field of LED carrier board preparation, in particular to a halogen-free high Tg yellowing-resistant copper clad laminate adhesive suitable for the field of LED packaging, a preparation method and application thereof. Background technique [0002] As a light source with small size, high heating efficiency, low power consumption and long service life, LED is widely used in display screens, lighting, radiation sources and other fields. [0003] In recent years, with the trend of miniaturization and thinning of LEDs, the packaging method of directly mounting components on printed wiring substrates has developed rapidly. [0004] With the development of high-brightness LED technology, LEDs have become more bright, and at the same time, the heat generation of LED components has increased. In the past, the substrate used to carry LED components due to high heat radiation caused the color of the substrate to age and turn yellow, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/04C09J11/06B32B17/04B32B17/06B32B15/04B32B15/20
CPCC09J163/00C09J11/04C09J11/06B32B5/02B32B5/26B32B15/14B32B15/20C08K2003/2241B32B2260/023B32B2260/046B32B2262/101C08L63/00C08K3/22C08K3/36C08K5/353
Inventor 张沛粟俊华席奎东蒋岳
Owner 南亚新材料科技(江西)有限公司