Chemical auxiliary force rheological polishing machining device for ceramic hemispheres

A hemispherical chemical and processing device technology, applied in the direction of grinding/polishing safety devices, metal processing equipment, grinding/polishing equipment, etc., can solve the problems of no noise reduction and dust suppression, excessive dust, strong noise, etc., and achieve convenience Effects of replacement and maintenance, improvement of applicability, and improvement of stability

Pending Publication Date: 2022-04-12
陶德珍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a ceramic hemispherical chemically assisted rheological polishing device, one of which is to have the function of double-sided grinding, so that the general polishing device can only polish one side during use and cannot simultaneously polish ceramics. The inside and outside of the product are polished at the same time, and the polishing efficiency is low; another purpose is to solve the problem that the general polishing device will generate a lot of dust and strong noise when polishing, and there is no noise reduction Dust equipment can easily affect the physical and mental health of the staff. It has the function of reducing dust and reducing noise during work to achieve the effect of improving the working environment

Method used

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  • Chemical auxiliary force rheological polishing machining device for ceramic hemispheres
  • Chemical auxiliary force rheological polishing machining device for ceramic hemispheres
  • Chemical auxiliary force rheological polishing machining device for ceramic hemispheres

Examples

Experimental program
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Effect test

Embodiment 1

[0039] Such as Figure 1-7 As shown, the present invention provides a ceramic hemispherical chemically assisted rheological polishing device, comprising a polishing table 1, an internal polishing assembly 5 and an external polishing assembly 6, the bottom of the polishing table 1 is fixedly equipped with a base 2, and the bottom of the polishing table 1 The surface is provided with a through hole 7, the upper part of the through hole 7 is provided with a fixed assembly 8, the upper part of the grinding table 1 is fixedly installed with a protective shell 3, the inside of the protective shell 3 is provided with an internal polishing assembly 5, and the inside of the base 2 is provided with an external polishing assembly. Assembly 6, the internal polishing assembly 5 includes a first polishing element 51, an upper connecting sleeve 52 and a hemispherical inner grinding member 53, the lower part of the first polishing element 51 is fixedly equipped with an upper connecting sleeve ...

Embodiment 2

[0041] Such as Figure 1-7 As shown, on the basis of Embodiment 1, the present invention provides a technical solution: preferably, the inner thread of the upper connecting sleeve 52 is connected with a first connecting column 54, and the bottom of the first connecting column 54 is fixedly installed with a hemispherical inner Grinding part 53, the top of hemispherical inner grinding part 53 and the inside of upper connecting sleeve 52 are flexibly connected through the first connecting column 54 provided, and ceramic polishing workpiece 13 is placed on the inner side of fixed ring 82 when in use, ceramic polishing workpiece 13 The outer wall of the outer wall is in contact with the non-slip concave-convex surface layer 837 to increase the friction force, and the rubber filling layer 836 is deformed with the second arc-shaped elastic sheet 833 and the buffer column 834 to fix the ceramic polishing workpiece 13, and at the same time, it is combined with the elastic hemisphere 838...

Embodiment 3

[0043] Such as Figure 1-7 As shown, on the basis of Embodiment 2, the present invention provides a technical solution: preferably, the upper part of the fixed ring 82 is fixedly equipped with a support rod 81, and the support rod 81 is fixedly installed on the inner top surface of the protective shell 3, and the through hole The upper part of 7 is provided with fixed ring 82, and the front of protective casing 3 is fixedly installed with transparent window protective window 4, and the side of protective casing 3 is fixedly installed with side door body 10, and the inner wall of protective stability element 83 is provided with ceramic polishing workpiece 13, and protective casing There is a place on the left side of 3, one end of the water supply tank 11 is fixedly connected with a water pipe, and one end of the water pipe is fixedly connected with a dust-reducing atomizing nozzle 12, and the dust-reducing atomizing nozzle 12 is fixedly installed on the inner top surface of the...

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PUM

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Abstract

The invention discloses a ceramic hemisphere chemical auxiliary force rheological polishing machining device, and relates to the technical field of polishing machining, the ceramic hemisphere chemical auxiliary force rheological polishing machining device comprises a grinding table, an internal polishing assembly and an external polishing assembly, a base is fixedly installed on the lower portion of the grinding table, a through hole is formed in the surface of the grinding table, and a fixing assembly is arranged on the upper portion of the through hole; a protective shell is fixedly mounted on the upper portion of the grinding table, and an internal polishing assembly is arranged in the protective shell. The ceramic polishing device has the functions of reducing dust and reducing noise in the working process, the working environment is effectively improved, and the first polishing element is arranged to drive the hemispherical inner polishing piece to polish the interior of a ceramic polishing workpiece; the second polishing element is used for driving the semispherical outer polishing part to polish the outer portion of the ceramic polishing workpiece, the outer portion and the inner portion of the ceramic polishing workpiece are polished at the same time, the polishing efficiency is effectively improved, and large-batch production is facilitated.

Description

technical field [0001] The invention relates to the technical field of polishing processing, in particular to a ceramic hemisphere chemically assisted rheological polishing processing device. Background technique [0002] Polishing technology is the final processing method to reduce surface roughness and obtain a non-damaging, smooth surface, and is the most important processing method for ultra-precision processing. Mechano-rheological polishing is proposed as a new polishing method based on the shear thickening effect of non-Newtonian fluids. It uses non-Newtonian fluids with shear thickening properties as the base liquid to prepare polishing fluids, and utilizes the shear thickening properties of the polishing fluids. Features achieve polish. Functional ceramics are one of the fastest-growing new materials in recent years. During the production and processing process, polishing is required to smooth the surface. There are following problems at prior art: [0003] 1. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/04B24B27/00B24B55/06B24B55/00B24B41/06B24B41/00G10K11/16
Inventor 陶德珍
Owner 陶德珍
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