Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of novel polymer packaging material for electronic components

A technology for electronic components and packaging materials, which is applied in the field of preparation of new polymer packaging materials for electronic components, can solve the problems that new polymer packaging materials cannot be well protected and anti-static, and achieve good protection and good gas barrier properties , Strengthen the effect of packaging protection

Inactive Publication Date: 2022-04-12
贵州德鹏塑胶有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a preparation method of a new polymer packaging material for electronic components to solve the problem that the existing new polymer packaging material cannot be better protected and anti-static

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1: the present invention provides a kind of technical scheme:

[0022] A method for preparing a novel polymer packaging material for electronic components, comprising the following preparation steps:

[0023] Step 1: raw material preparation: prepare polyvinyl alcohol resin, polyethylene terephthalate, high-density polyethylene, polyvinylidene fluoride, polycarbonate, polyvinyl chloride and additives according to a certain weight ratio, wherein The proportioning by weight of polyvinyl alcohol resin, polyethylene terephthalate, high-density polyethylene, polyvinylidene fluoride, polycarbonate, polyvinyl chloride and additives is 60 parts by weight of polyvinyl alcohol resin, 50 parts by weight of polyethylene terephthalate, 130 parts by weight of high-density polyethylene, 60 parts by weight of polyvinylidene fluoride, 35 parts by weight of polycarbonate, 80 parts by weight of polyvinyl chloride and 20 parts by weight of additives;

[0024] Step 2: Raw materi...

Embodiment 2

[0029] Embodiment 2: the present invention provides a kind of technical scheme:

[0030] A method for preparing a novel polymer packaging material for electronic components, comprising the following preparation steps:

[0031] Step 1: raw material preparation: prepare polyvinyl alcohol resin, polyethylene terephthalate, high-density polyethylene, polyvinylidene fluoride, polycarbonate, polyvinyl chloride and additives according to a certain weight ratio, wherein The proportioning by weight of polyvinyl alcohol resin, polyethylene terephthalate, high-density polyethylene, polyvinylidene fluoride, polycarbonate, polyvinyl chloride and additives is 70 parts by weight of polyvinyl alcohol resin, polyvinyl alcohol resin 65 parts by weight of ethylene terephthalate, 153 parts by weight of high-density polyethylene, 64 parts by weight of polyvinylidene fluoride, 35 parts by weight of polycarbonate, 100 parts by weight of polyvinyl chloride and 22 parts by weight of additives;

[003...

Embodiment 3

[0037] Embodiment 3: the present invention provides a kind of technical scheme:

[0038] A method for preparing a novel polymer packaging material for electronic components, comprising the following preparation steps:

[0039] Step 1: raw material preparation: prepare polyvinyl alcohol resin, polyethylene terephthalate, high-density polyethylene, polyvinylidene fluoride, polycarbonate, polyvinyl chloride and additives according to a certain weight ratio, wherein The proportioning by weight of polyvinyl alcohol resin, polyethylene terephthalate, high-density polyethylene, polyvinylidene fluoride, polycarbonate, polyvinyl chloride and additives is 80 parts by weight of polyvinyl alcohol resin, polyvinyl alcohol resin 66 parts by weight of ethylene terephthalate, 165 parts by weight of high-density polyethylene, 68 parts by weight of polyvinylidene fluoride, 38 parts by weight of polycarbonate, 98 parts by weight of polyvinyl chloride and 23 parts by weight of additives;

[0040...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of polymer packaging materials, in particular to a preparation method of a novel polymer packaging material for electronic components. Comprising the following preparation steps: preparing 60 to 80 parts by weight of polyvinyl alcohol resin, 50 to 70 parts by weight of polyethylene glycol terephthalate, 130 to 170 parts by weight of high density polyethylene, 60 to 70 parts by weight of polyvinylidene fluoride, 35 to 38 parts by weight of polycarbonate, 80 to 100 parts by weight of polyvinyl chloride and 20 to 24 parts by weight of an additive; adding polyvinyl alcohol resin, polyethylene glycol terephthalate, high-density polyethylene, polyvinylidene fluoride, polycarbonate and polyvinyl chloride into the reaction kettle, and heating and stirring through the reaction kettle; according to the polymer packaging material produced through the technical scheme, the good strength is guaranteed, the use effect is guaranteed, the problem of static electricity can be effectively prevented, and therefore electronic components are well protected.

Description

technical field [0001] The invention relates to the technical field of polymer packaging materials, in particular to a method for preparing a novel polymer packaging material for electronic components. Background technique [0002] Polymer packaging materials are widely used in food, medicine, components and other fields. When polymer packaging materials are used to package components, it is necessary to consider the protection and static discharge treatment of electronic components by polymer packaging materials. However, currently on the market Most of the existing new polymer packaging materials for electronic components are mostly general-purpose materials, or slightly modified on general-purpose materials, which cannot protect electronic components well. Therefore, in view of the above problems, a proposal A method for preparing a novel polymer packaging material for electronic components. Contents of the invention [0003] The purpose of the present invention is to ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/06C08L29/04C08L67/02C08L27/16C08L27/06C08L69/00
Inventor 孙德华
Owner 贵州德鹏塑胶有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com