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Photosensitive resin composition and application thereof

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve problems such as circuit short circuit

Pending Publication Date: 2022-04-12
CHANGZHOU ZHENGJIE INTELLIGENT MFG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the dry film development stage, the unexposed part is usually washed away with an alkaline aqueous solution, and the components of the photosensitive resin composition dissolved or dispersed in the developer are easy to separate out and form residue or scum. If the development residue or scum is attached to the On the substrate, the circuit formed in the subsequent process will have short circuit and other defects.

Method used

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  • Photosensitive resin composition and application thereof
  • Photosensitive resin composition and application thereof
  • Photosensitive resin composition and application thereof

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Embodiment Construction

[0017] Around the above purpose of the present invention, various aspects are described in more detail below.

[0018] In the present invention, the term "alkyl" can be a straight chain, branched or cyclic alkyl group; and the chain can contain at least one double bond, triple bond or a combination thereof, that is, "alkyl" includes alkenyl and Alkynyl.

[0019] Unless otherwise explicitly stated, other terms have meanings commonly understood in the art.

[0020]

[0021] As mentioned above, the photosensitive resin composition of the present invention comprises (A) a hexaarylbiimidazole-based mixed photoinitiator and (B) an alkali-soluble polymer.

[0022] Hexaaryl bis-imidazole mixed photoinitiator (A)

[0023] The hexaarylbiimidazole (ie HABI) mixed photoinitiator of the present invention has a structure as shown in general formula (I), wherein 2-1', 2-3', 2'-1 and 2'-3 Four kinds of bis-imidazole compounds at linking positions, the total mass percentage of the four l...

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Abstract

The invention discloses a photosensitive resin composition. The photosensitive resin composition comprises (A) a hexaaryl biimidazole mixed photoinitiator with a structure as shown in a general formula (I) and (B) an alkali-soluble polymer obtained by carrying out polymerization reaction on a monomer containing a compound as shown in a general formula (II). The composition has excellent resolution and adhesive force during application, is good in compatibility and stability, has excellent developing property, and can remarkably reduce the sludge amount in a developing solution during recycling, so that the developing solution can be repeatedly and effectively used for multiple times.

Description

technical field [0001] The invention belongs to the technical fields of organic chemistry and photocuring, and in particular relates to a photosensitive resin composition and its application. Background technique [0002] With the miniaturization of wiring intervals in printed wiring boards in recent years, dry film resists require high resolution and high adhesion in order to manufacture fine-pitch patterns with high yield. Therefore, as the density of printed circuit boards is higher and higher, the contact area between the circuit and the substrate becomes smaller and smaller, and the photosensitive resin composition that can form a resist pattern with excellent resolution and adhesion The requirements are also getting higher and higher. [0003] Generally, a photosensitive resin composition includes an alkali-soluble polymer, a compound having an ethylenically unsaturated double bond, a photopolymerization initiator, and a solvent. Various additives can also be used as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075G03F7/004H05K3/28
Inventor 严春霞
Owner CHANGZHOU ZHENGJIE INTELLIGENT MFG TECH CO LTD