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Transfer device and LED chip transfer method

A technology of LED chips and transfer devices, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of reducing transfer efficiency, detecting transfer completion rate, and increasing costs, so as to simplify bonding steps, reduce transfer costs, and improve bonding. combined efficiency effect

Pending Publication Date: 2022-04-12
SHENZHEN SITAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the mass transfer method and device of Micro LED require a large number of transfer head matrices or pretreatment of chips to realize the mass transfer of Micro LED, but these key molds and processing steps will inevitably increase the cost and reduce the transfer efficiency. It is convenient to detect the transfer completion rate, so the above problems need to be solved

Method used

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  • Transfer device and LED chip transfer method
  • Transfer device and LED chip transfer method
  • Transfer device and LED chip transfer method

Examples

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Embodiment Construction

[0037] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0038] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and similar...

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Abstract

The invention provides a transfer device and an LED chip transfer method, and belongs to the field of LED display. The transfer device comprises a first container and a second container, the first container and the second container are communicated through a flow guide pipe, and liquid and an LED chip are arranged in the first container and / or the second container; a partition plate is arranged in the second container, the partition plate and the bottom of the second container define a containing cavity, an opening is formed in the partition plate, and a plurality of transfer substrates are arranged on the side, away from the bottom of the second container, of the partition plate; the second container is provided with an ultrasonic vibration module and a control module; a detection module is arranged on the inner wall of the second container, and the detection module and the ultrasonic vibration module are electrically connected to the control module. According to the transfer device provided by the invention, the bonding step of the LED chip and the transfer substrate is simplified, and the transfer cost of the LED chip is reduced.

Description

technical field [0001] The invention relates to the field of LED display, in particular to a transfer device and an LED chip transfer method. Background technique [0002] Micro LED (light-emitting diode, light-emitting diode) micron-level pixel pitch can make it cover multiple application scenarios from small and medium-sized displays to medium and large-sized displays. Compared with traditional small-pitch LEDs, it significantly improves the display Resolution and image quality, the optical design can make the viewing angle wider, the contrast ratio is higher, and the image quality is better. It is suitable for various display scenarios such as virtual reality, small projectors, microdisplays, visible light communication, and medical research. [0003] At present, the mass transfer method and device of Micro LED require a large number of transfer head matrices or pretreatment of chips to realize the mass transfer of Micro LED, but these key molds and processing steps will ...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L21/683
Inventor 李岳
Owner SHENZHEN SITAN TECH CO LTD