Flexible substrate bubble repairing method, flexible substrate and flexible display panel

Abstract

The invention provides a flexible substrate bubble repairing method, a flexible substrate and a flexible display panel. The repairing method comprises the following steps: detecting and determining the position of a bubble of the flexible substrate; positioning the laser beam to the position of the bubble of the flexible substrate; starting a laser beam to radiate the bubbles of the flexible substrate so as to remove the bubbles of the flexible substrate; modifying an inclination angle of a pit formed after the bubbles of the flexible substrate are removed by using an etching process; and depositing at least one inorganic film layer. According to the method, the bubbles are removed through the laser beams, and the inclination angle of the concave hole left by removing the bubbles is modified through the etching process, so that the repaired interface becomes gentle, the situation that the flexible substrate is exposed due to the fact that the concave hole cannot be completely covered due to the too large inclination angle of the concave hole in subsequent repair of the inorganic film layer is avoided, and meanwhile, the flexible substrate is protected. The overall optical performance of the repaired flexible substrate cannot be changed, subsequent OLED evaporation alignment cannot be affected, the yield of flexible OLED products is greatly improved, and economic losses caused by scrapping are reduced.

Description

technical field [0001] The invention relates to the field of display panels, in particular to a method for repairing air bubbles on a flexible substrate, a flexible substrate and a flexible display panel. Background technique [0002] The OLED display device can be roughly divided into three components, the driving circuit, the OLED light-emitting layer and the subsequent assembly part. [0003] In the manufacturing process of OLED display devices, such as in the manufacturing process of the driving circuit, when polyimide is used as a flexible substrate, bubbles will be generated in the subsequent high-temperature process due to insufficient solvent removal during the curing process of polyimide. The size of this type of bubbles is relatively large. Due to the risk of bursting of high-energy bubbles in the excimer crystallization process, the entire glass will be scrapped, which is not conducive to the cost control of the panel factory. [0004] There are mainly two types ...

AI Technical Summary

Problems solved by technology

The size of this type of bubbles is relatively large, which is limited by the risk of bursting of high-energy bubbles in the excimer crystallization process, resulting in the scrapping of the entire glass, which is not conducive to the cost control of the panel factory

[0004] There are mainly two types of current repair schemes: 1. Only repair but not repair; 2. Combined repair. Scheme 1 uses laser beams. The problem is that the laser beams cause large cavities and large inclination angles, so that the subsequent inorganic functional films cannot be repaired. Covering and repairing the bare and leaked polyimide layer, causing the subsequent excimer crystallization process to directly irradiate the polyimide material with high energy, carbonizing the polyimide and polluting the machine. At the same time, the large glass plate still cannot be flowed ;Scheme 2 is to use polyimide to fill and re-cure after repairing. There are side effects for the first layer of original polyimide film layer baked twice: the transmittance is reduced, which affects the alignment of OLED evaporation; the filling area Due to the high viscosity of polyimide, the surface tension of the polyimide film causes the surface of the polyimide film to bulge, and it is also unable to flow backward.

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