38results about How to "Does not affect alignment" patented technology

The invention discloses a portable electronic device which comprises a shell, a mainboard, a bottom cover, and a switch module, wherein the mainboard is configured in the shell, the bottom cover is detachably arranged on the shell and is provided with a bolt, and the switch module comprises a switch and a sliding piece. The switch is fixed on the shell and is provided with a shift lever. The switch is electrically connected to the mainboard through a wire. The sliding piece is slideably arranged on the shell and is connected to the shift lever. The sliding piece is provided with an opening and the bolt is inserted into the opening. When the bottom cover is detached from the shell, the bolt drives the sliding piece to move relative to the shell and then the sliding piece drives the shift lever to move so as to turn off the switch.

The invention discloses a thrust bearing experimental device capable of replacing a friction pair conveniently. The thrust bearing experimental device comprises an experimental cavity constituted by an experimental cavity base, an experimental cavity, and an experimental cavity top cover. The experimental cavity is filled with lubrication medium, and a testing bearing constituted by a bearing pedestal, an experimental thrust bearing shoe, and a friction pair disc is disposed in the experimental cavity. The bearing pedestal is disposed on the experimental cavity base, and the friction pair disc is provided with a thrust disc, and is fixedly connected with the thrust disc by a torque transmission pin. A rotating shaft passes through the experimental cavity, and is fixedly connected with the thrust disc. The thrust bearing experimental device is advantageous in that the problem that the replacement of the pairing friction pair requiring the replacement of the whole thrust disc is prevented, and the replacement cost is reduced, and at the same time, the experimental devices has a wider material application range; the radial and axial limiting of the experimental thrust bearing shoe is realized, and the assembly process is simplified; after the simple disassembly process, the experimental thrust bearing shoe can be taken out along a radial direction without disassembling the shafting, and therefore the centring performance of the whole shafting cannot be affected, and the requirement of the material pairing experiment on the frequent replacement of the experimental thrust bearing shoe is satisfied.

The invention discloses an organic thin film transistor, comprising a substrate, a source / drain layer, a first buffer layer, a semiconductor layer, a gate insulating layer, and a gate electrode, wherein the source / drain layer is located on the substrate and has a source region and a drain region; the first buffer layer is located between the source region and the drain region and covers at least part of the source region and at least part of the drain region; the semiconductor layer is located on the source / drain layer and the first buffer layer; the first buffer layer is located among the semiconductor layer, the source region, the drain region, and the substrate; the gate insulating layer covers the source / drain layer and the semiconductor layer; the gate electrode is located on the gateinsulating layer, and part of the gate insulating layer is located between the gate electrode and the semiconductor layer; and the first buffer layer may be used to fill the space between the sourceregion and the drain region to prevent the semiconductor layer from being formed on the wedge undercut structure of the source region and the drain region, so that the semiconductor layer has an eventhickness to improve the electrical stability of the organic thin film transistor.

The present invention relates to a semiconductor device and a manufacturing method thereof, the method comprising: providing a semiconductor substrate, an interlayer dielectric layer is formed on the semiconductor substrate, a contact hole is formed in the interlayer dielectric layer, and photolithography mark holes, the photolithography mark holes have gaps; deposit a sacrificial material layer to completely fill the gaps; form a protective layer on the interlayer dielectric layer and the sacrificial material layer; Forming through-silicon holes in the bottom and the interlayer dielectric layer; removing the protection layer to expose the sacrificial material layer; removing the sacrificial material layer to expose the gap. The present invention proposes to use a-C as the protective layer of CT in the TSV VIA middle process. Compared with SIN, a-C has better step coverage ability and can be completely removed, so as not to affect the subsequent first metal Layer lithography (M1photo) alignment effectively solves the problem of OVL measurement.

The invention discloses a superconducting single-photon detector, which comprises a chip fixing platform, an optical fiber fixing platform and a beam-focusing system. The invention also discloses a package method based on the superconducting single-photon detector, which comprises the following steps: (a) aligning a detection area of a chip with an intermediate small hole of the chip fixing platform; (b) fixing a fiber pigtail and inputting a visible reference beam through another interface of the optical fiber; and (c) by observing an optical system, finely tuning the position between a beamoutlet of the optical fiber and the detection area of the chip to fix the optical fiber fixing platform and the chip fixing platform. The single-photon detector can work at a temperature of between 1.8 and 300K, and the alignment of beams and components are not influenced by the increase and the reduction of temperature. A detector packaged by the superconducting single-photon detector and the method has high photon coupling efficiency, stable work and high reliability and can be used for measuring for a plurality of times with good repeatability.