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Monocrystalline silicon wafer polishing equipment and polishing method thereof

A technology for single crystal silicon wafers and equipment, which is applied in the field of single crystal silicon wafer polishing equipment and its polishing, can solve the problems of high pressure on single crystal silicon wafers and cracking of single crystal silicon wafers, and achieve safety, simple structure, and convenience The effect of actual use

Inactive Publication Date: 2022-04-15
朱秀洁
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The single crystal silicon wafer polishing equipment on the market often puts too much pressure on the single crystal silicon wafer during the polishing process of the single crystal silicon wafer, which leads to the cracking of the single crystal silicon wafer during the polishing process

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  • Monocrystalline silicon wafer polishing equipment and polishing method thereof
  • Monocrystalline silicon wafer polishing equipment and polishing method thereof
  • Monocrystalline silicon wafer polishing equipment and polishing method thereof

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Embodiment Construction

[0037] see Figure 1-7 , the present invention provides a technical solution: a single crystal silicon wafer polishing equipment and polishing method thereof, including a seating base 1 and a polishing assembly 8, a feeding conveyor belt 2 is provided in the left middle of the upper end of the seating base 1, and the seating base The middle part of the upper right side of the upper end of 1 is provided with a feeding conveyor belt 3, and the upper end of the seating seat 1 is provided with a fixed frame 4 near the edge, and the upper end of the seating seat 1 is provided with a feeding assembly 5 for feeding single crystal silicon wafers on both sides, and placed The center position of the upper end of the seat 1 is provided with a bearing assembly 6 for carrying monocrystalline silicon wafers, a middle partition 7 is provided in the middle of the inner side of the fixed frame 4, and a polishing assembly 8 for polishing monocrystalline silicon wafers is arranged on the inner si...

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Abstract

The invention discloses monocrystalline silicon wafer polishing equipment and a polishing method thereof, and relates to the technical field of monocrystalline silicon wafer production.The monocrystalline silicon wafer polishing equipment comprises a placement seat and a polishing assembly, a feeding conveying belt is arranged in the middle of the left side of the upper end of the placement seat, and a discharging conveying belt is arranged in the middle of the right side of the upper end of the placement seat; a fixing frame is arranged at the upper end, close to the edge, of the placement base. According to the single crystal silicon wafer double-face polishing device, double-face effective polishing work of the single crystal silicon wafer is achieved, automatic integrated work of feeding, conveying, polishing and cleaning of the single crystal silicon wafer is achieved, workers do not need to manually feed and discharge the single crystal silicon wafer, the actual polishing efficiency of the single crystal silicon wafer is effectively improved while the polishing work safety of the single crystal silicon wafer is guaranteed, and the production cost is reduced. According to the single crystal silicon wafer polishing device, the double-face polishing work of the single crystal silicon wafer can be achieved without overturning the single crystal silicon wafer, the polishing time of the single crystal silicon wafer is shortened, fines generated in the polishing process can be effectively collected, and the situation that the fines remain on the working face and affect the polishing precision of the single crystal silicon wafer is avoided.

Description

technical field [0001] The invention relates to the technical field of single crystal silicon wafer production, in particular to a single crystal silicon wafer polishing equipment and a polishing method thereof. Background technique [0002] Monocrystalline silicon is a relatively active non-metallic element, an important part of crystalline materials, and is at the forefront of the development of new materials. Its main uses are as semiconductor materials and the use of solar photovoltaic power generation, heating and so on. Because solar energy has many advantages such as cleanliness, environmental protection, and convenience, in the past 30 years, solar energy utilization technology has made great progress in research and development, commercial production, and market development, and has become one of the emerging industries with rapid and stable development in the world. Polishing equipment is required in the production process of monocrystalline silicon wafers. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B41/06B24B41/00B24B55/06B24B55/12B24B1/00
Inventor 朱秀洁
Owner 朱秀洁