Preparation method, product and application of additive for electrolytic copper foil of flexible copper-clad plate

A technology of flexible copper clad laminate and electrolytic copper foil, which is applied in electrolytic process, printed circuit manufacturing, electroforming, etc., to achieve the effects of high elongation, flat grain, and high technical added value

Pending Publication Date: 2022-04-15
安徽华威铜箔科技有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

Multi-functional high-density electronic digital products; can only develop towards fine and high-density collection

Method used

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Embodiment Construction

[0027] The following clearly and completely describes the technical solutions in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] This embodiment provides a method for preparing an additive for electrolytic copper foil of a flexible copper clad laminate, comprising the following steps:

[0029] (1) Prepare the following raw materials:

[0030] Sodium 3-mercaptopropanesulfonate

[0031] Sodium Polydisulfide Dipropane Sulfonate

[0032] Low molecular glue

[0033] Thiourea

[0034] Sodium Alcoholthiopropane Sulfonate

[0035] Polyethylene glycol 12000#

[0036] Hydroxyethyl cellulose 6000#

[0037] Its mass ratio is: 1:1.5:0.5:1:1.5:1:2;

[0038] (2)...

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PUM

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Abstract

The invention discloses a preparation method of an additive for an electrolytic copper foil of a flexible copper-clad plate, a product and application of the additive. The additive for the electrolytic copper foil of the flexible copper-clad plate comprises the following raw materials: sodium 3-mercaptopropane sulfonate, sodium dithiodipropane sulfonate, low-molecular glue, thiourea, sodium alcohol thiopropane sulfonate, polyethylene glycol 12000 # and hydroxyethyl cellulose 6000 #. The electrolytic copper foil produced by the additive disclosed by the invention is flat in surface crystal grain, low in profile, high in tensile strength and high in ductility, and has a relatively good adhesion effect and characteristics with a polyimide base film. The material can be used for a high-end flexible copper-clad plate (FCCL) circuit board base material. The additive is low in cost, wide in process application range and convenient in process control, and ensures product quality and benefits. After the high-temperature tensile strength of the copper foil reaches 500 MPa or above, the appearance and brightness of the foil surface are controlled only by adjusting the low-molecular glue and the sodium 3, 3 '-dithiodipropane sulfonate, the high-temperature tensile strength is improved, meanwhile, the ductility is kept at 4% or above, and the requirement of the market for the copper foil is completely met.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil production and manufacturing, in particular to a preparation method, product and application of an additive for electrolytic copper foil of a flexible copper clad laminate. Background technique [0002] Flexible Copper Clad Laminate (FCCL) is thin, light and flexible. FPC using FCCL as the substrate material is widely used in electronic products such as mobile phones, digital cameras, digital video cameras, automotive satellite direction positioning devices, LCD TVs, and notebook computers. [0003] In addition to the advantages of thinness, lightness and flexibility, FCCL with polyimide base film also has the characteristics of excellent electrical properties, thermal properties and heat resistance. Its low dielectric constant (Dk) enables fast transmission of electrical signals. Good thermal performance, which can make components easy to cool down. A higher glass transition t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04H05K3/18
Inventor 陈韶明陈嘉豪黄河
Owner 安徽华威铜箔科技有限公司
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