Adhesive tape for semiconductor processing
A semiconductor and adhesive tape technology, applied in semiconductor/solid-state device manufacturing, adhesives, film/sheet adhesives, etc., can solve problems such as ring frame peeling, and achieve reliable bonding effects
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Example Embodiment
[0211]
[0212] The adhesive composition A of this first adhesive layer is applied to the spacer of the first adhesive layer, which is applied to the thickness of the first adhesive layer to 5 μm after the spacer of the polyethylene terephthalate film after the release treatment. After drying at 110 ° C for 3 minutes, it is bonded to the substrate film A, and the adhesive sheet A which is formed in the base film A.
[0213] Next, the adhesive composition A of this second adhesive layer is applied to the spacer of the cutting sheet after the release treatment after the release treatment. After drying at 110 ° C for 3 minutes, the thickness was bonded to the polyethylene terephthalate film after peeling treatment, and a plurality of polyethylene terephthalate films were formed. The adhesive sheet B of the mixture layer B.
[0214] Further, the adhesive composition A is applied to the base tape formed by the strip-treated long-stripped polyethylene terephthalate film, so that the th...
Example Embodiment
[0218]
[0219] In addition to the binder composition A of the second adhesive layer, the sample of the semiconductor processing tape of Example 2 was fabricated in the same manner as in Example 1, in the same manner as in Example 1, except that the binder composition B of the second adhesive layer was used. .
Example Embodiment
[0220]
[0221] In addition to the binder composition A of the second adhesive layer, the sample of the semiconductor processing of Example 3 was produced in the same manner as in Example 1, and the sample of the second adhesive layer was used. .
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