Adhesive tape for semiconductor processing
A semiconductor and adhesive tape technology, applied in semiconductor/solid-state device manufacturing, adhesives, film/sheet adhesives, etc., can solve problems such as ring frame peeling, and achieve reliable bonding effects
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Embodiment 1
[0212] The adhesive composition A of this first adhesive layer was coated on the spacer made of the elongated polyethylene terephthalate film after the mold release treatment so that the thickness after drying became 5 μm. , after drying at 110° C. for 3 minutes, it was bonded to the base film A, and the adhesive sheet A in which the first adhesive layer was formed on the base film A was produced.
[0213] Then, on the spacer made of the cut sheet-shaped polyethylene terephthalate film after the mold release treatment, the adhesive composition A of the second adhesive layer is coated, and the dried The thickness becomes 10 μm, after drying at 110°C for 3 minutes, it is attached to the peeled polyethylene terephthalate film, and a plurality of second adhesive films are formed on the polyethylene terephthalate film. Adhesive sheet B of the mixture layer.
[0214] In addition, the adhesive composition A was applied to a substrate tape made of a long polyethylene terephthalate fi...
Embodiment 2
[0219] A sample of the adhesive tape for semiconductor processing of Example 2 was produced in the same manner as in Example 1 except that the adhesive composition A of the second adhesive layer was used instead of the adhesive composition A of the second adhesive layer. .
Embodiment 3
[0221] A sample of the adhesive tape for semiconductor processing of Example 3 was produced in the same manner as in Example 1, except that the adhesive composition A of the second adhesive layer was used instead of the adhesive composition A of the second adhesive layer. .
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