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Adhesive tape for semiconductor processing

A semiconductor and adhesive tape technology, applied in semiconductor/solid-state device manufacturing, adhesives, film/sheet adhesives, etc., can solve problems such as ring frame peeling, and achieve reliable bonding effects

Pending Publication Date: 2022-04-15
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As described above, when the adhesive force of the adhesive layer decreases, there is a possibility that the ring frame will peel off from the adhesive layer.

Method used

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  • Adhesive tape for semiconductor processing
  • Adhesive tape for semiconductor processing
  • Adhesive tape for semiconductor processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0212] The adhesive composition A of this first adhesive layer was coated on the spacer made of the elongated polyethylene terephthalate film after the mold release treatment so that the thickness after drying became 5 μm. , after drying at 110° C. for 3 minutes, it was bonded to the base film A, and the adhesive sheet A in which the first adhesive layer was formed on the base film A was produced.

[0213] Then, on the spacer made of the cut sheet-shaped polyethylene terephthalate film after the mold release treatment, the adhesive composition A of the second adhesive layer is coated, and the dried The thickness becomes 10 μm, after drying at 110°C for 3 minutes, it is attached to the peeled polyethylene terephthalate film, and a plurality of second adhesive films are formed on the polyethylene terephthalate film. Adhesive sheet B of the mixture layer.

[0214] In addition, the adhesive composition A was applied to a substrate tape made of a long polyethylene terephthalate fi...

Embodiment 2

[0219] A sample of the adhesive tape for semiconductor processing of Example 2 was produced in the same manner as in Example 1 except that the adhesive composition A of the second adhesive layer was used instead of the adhesive composition A of the second adhesive layer. .

Embodiment 3

[0221] A sample of the adhesive tape for semiconductor processing of Example 3 was produced in the same manner as in Example 1, except that the adhesive composition A of the second adhesive layer was used instead of the adhesive composition A of the second adhesive layer. .

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PUM

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Abstract

Provided is an adhesive tape for semiconductor processing, which can easily peel off a chip with an adhesive layer from an adhesive layer during pickup, can reliably adhere and fix a ring frame, and does not cause floating of the adhesive layer during bonding of a semiconductor wafer. This adhesive tape (1) for semiconductor processing is provided with a base film (41), a first adhesive layer (42), and a second adhesive layer (43) in this order, and is characterized in that an adhesive layer (3) is provided on the surface of the second adhesive layer (43) on the opposite side from the base film (41) and the first adhesive layer (42), the adhesive force of the first adhesive layer (42) being greater than the adhesive force of the second adhesive layer (43), and the adhesive force of the second adhesive layer (43) being greater than the adhesive force of the second adhesive layer (43). The first adhesive layer (42), the second adhesive layer (43), and the adhesive layer (3) each have a planar shape, the planar shape of the adhesive layer (3) is larger than the planar shape of the second adhesive layer (43), the planar shape of the first adhesive layer (42) is larger than the planar shape of the adhesive layer (3), and the first adhesive layer (42) is in contact with the adhesive layer (3) at the peripheral edge of the second adhesive layer (43).

Description

technical field [0001] The present invention relates to an adhesive tape having an adhesive layer on a base film, and an adhesive tape for semiconductor processing having an adhesive layer bonded to a semiconductor wafer on the adhesive layer. Background technique [0002] Conventionally, in a manufacturing process of a semiconductor device, an adhesive tape for bonding and holding a semiconductor wafer is used in a dicing process of an individualized semiconductor wafer. Moreover, in order to simplify the process more, the tape for semiconductor processing which integrated the adhesive layer for chip fixing required in a mounting process is proposed (for example, refer patent document 1). [0003] After singulating the semiconductor wafer in the dicing process, the individualized chips are pushed up through the push-up push pin in the pick-up process, thereby picking up with the peeling of the adhesive layer from the adhesive layer, and then picked up in the mounting proces...

Claims

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Application Information

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IPC IPC(8): C09J7/20C09J7/38H01L21/683
CPCC09J201/00C09J7/20C09J7/38H01L21/683H01L21/52H01L21/30C09J2301/312C09J2301/1242C09J2301/208C09J2203/326C09J2301/416C09J2301/502C09J2301/21
Inventor 土屋贵德石黑邦彦
Owner FURUKAWA ELECTRIC CO LTD
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