Cooling device for forming soldering tin bar

Abstract

The cooling device comprises a cooling water tank, the top of the cooling water tank is fixedly connected with a frame box, the top of an inner cavity of the frame box is transversely and fixedly connected with a transverse plate, the top of the transverse plate is fixedly connected with a three-end water pump, and the output end of the three-end water pump communicates with a water pumping pipe; the side, away from the three-end water pump, of the water pumping pipe extends to the outer side of the cooling water tank and communicates with the cooling water tank, the input end of the three-end water pump communicates with a flow dividing pipe, and the bottom of the flow dividing pipe communicates with a drainage pipe. According to the cooling device for forming the soldering tin bar, the effect of circulating cooling can be achieved, and the problems that when an existing cooling device cools the soldering tin bar, after water in a water tank makes contact with the soldering tin bar for a long time, the water temperature rises, the cooling speed of the soldering tin bar can be reduced, the forming speed of the soldering tin bar is low, and the service life of the soldering tin bar is prolonged are solved. And the overall processing progress is influenced.

Description

technical field [0001] The invention relates to the technical field of solder bars, in particular to a cooling device for forming solder bars. Background technique [0002] The solder bar needs to be cooled after it is processed and shaped. At this time, a cooling device is needed. However, when the existing cooling device cools the solder bar, the water temperature in the water tank will decrease after a long time of contact with the solder bar. It will rise, which will slow down the cooling speed of the solder bar, making the forming speed of the solder bar slower, and affecting the overall processing progress. Contents of the invention [0003] In order to solve the problems raised in the above-mentioned background technology, the purpose of the present invention is to provide a cooling device for solder bar molding, which has the advantage of circulating cooling, and solves the problem of the water tank when the existing cooling device cools the solder bar. After long...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems raised in the above-mentioned background technology, the purpose of the present invention is to provide a cooling device for solder bar molding, which has the advantage of circulating cooling, and solves the problem of the water tank when the existing cooling device is cooling the solder bar. After the water in the water contacts with the solder bar for a long time, its water temperature will rise, which will slow down the cooling speed of the solder bar, make the forming speed of the solder bar slower, and affect the overall processing progress.

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