Nano-silver coated micron copper soldering paste and preparation method thereof

A technology of micron copper and silver-clad copper, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of high cost of nano-solder, harsh sintering conditions, complex sintering conditions, etc., to overcome the difficulty of storage and oxidation resistance Good, the effect of overcoming the high cost

Pending Publication Date: 2022-04-22
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But copper is easy to be oxidized, nano-copper particles are more likely to be oxidized, not easy to store, and the sintering conditions are more complicated
And the cost of nano-solder is high
[

Method used

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  • Nano-silver coated micron copper soldering paste and preparation method thereof
  • Nano-silver coated micron copper soldering paste and preparation method thereof
  • Nano-silver coated micron copper soldering paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0039] Example 1

[0040] The preparation of nano-silver-coated micro-copper solder paste includes the following steps:

[0041] (1) Put 5g of micron copper particles into a beaker, add 50ml of dilute nitric acid with a mass fraction of 5% for acidification, ultrasonically vibrate for 5min, use a high-speed centrifuge to carry out liquid-solid separation under the condition of 4000r / min, and the obtained copper particles are deionized Washed with water three times to obtain product A, that is, acidified micron copper particles.

[0042](2) put the product A obtained in step (1) into a beaker, add 300ml of deionized water, add 4g of ascorbic acid, 4g of polyvinylpyrrolidone (PVP), stir and dissolve by heating in a water bath at 40°C, dropwise the concentration of 0.3mol / L Silver nitrate solution 60mL, continue to stir during the dropwise addition, keep the stirring rate of 300r / min after the dropwise addition, continue to react in a 40℃ water bath for 1h, after the reaction is...

Example Embodiment

[0045] Example 2

[0046] The preparation of nano-silver-coated micro-copper solder paste, the steps are as follows:

[0047] (1) Put 10g of micron copper particles into a beaker, acidify with 100ml of dilute sulfuric acid with a mass fraction of 8%, ultrasonically vibrate for 8min, use a high-speed centrifuge to carry out liquid-solid separation under the condition of 4000r / min, and the obtained copper particles are deionized The product A was obtained by washing with water three times.

[0048] (2) Put product A into a beaker, add 300ml of deionized water, add 6g of hydrazine hydrate, 2g of cetyltrimethylammonium bromide, heat in a water bath at 50°C, stir and dissolve, and dropwise add a concentration of 0.4mol / L. Silver nitrate solution 80mL, continue to stir during the dropwise addition, keep the stirring rate of 400r / min after the dropwise addition, and continue to react in a 50°C water bath for 2h. After the reaction is completed, use a high-speed centrifuge to conduct...

Example Embodiment

[0050] Example 3

[0051] The preparation of nano-silver-coated micro-copper solder paste includes the following steps:

[0052] (1) Put 15g of micron copper particles into a beaker, acidify with 150ml of dilute nitric acid with a mass fraction of 5%, ultrasonically vibrate for 10min, use a high-speed centrifuge to carry out liquid-solid separation under the condition of 4000r / min, and the obtained copper particles are deionized The product A was obtained by washing with water three times.

[0053] (2) Put product A into a beaker, add 300ml of deionized water, add 8g of sodium borohydride, 24g of PVP, heat at 70°C and stir to dissolve, dropwise add 1100mL of silver nitrate solution with a concentration of 1mol / L, and continue during the dropping process. Stir, keep the stirring rate of 500r / min after the dropwise addition is completed, and continue to react in a 70°C water bath for 3h. After the reaction is completed, use a high-speed centrifuge to carry out liquid-solid sepa...

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Abstract

The invention discloses nano-silver coated micron copper soldering paste and a preparation method thereof, and belongs to the technical field of electronic packaging connecting materials. The nano-silver coated micron copper soldering paste comprises silver coated copper particles with micron copper as a core and nano-silver as a shell, and the molar ratio of the micron copper to the nano-silver is (5-1): (1-5). Silver-coated copper particles are prepared through a chemical plating method, and the surfaces of micron copper particles are coated with silver elements in the form of nano-silver particles; according to the silver-coated copper particles prepared through chemical plating, compared with direct physical mixing of micron copper particles and nano silver particles, mixing is more uniform, and oxidation resistance is better; the method has the advantages of being simple in process, low in cost and high in production efficiency, after the soldering paste is prepared, the high specific surface of the nano-silver particles can provide larger driving force for the sintering process of the nano-silver-coated micron copper soldering paste, the sintering temperature can be remarkably reduced, and the sintering density of the nano-silver-coated micron copper soldering paste can be improved.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging connection materials, and in particular relates to a nano-silver-coated micro-copper solder paste and a preparation method thereof. Background technique [0002] The rapid update and iteration of the high-tech industry has put forward high-temperature, high-voltage, and high-frequency requirements for electronic devices, which has accelerated the industrialization of the third-generation semiconductors. The third-generation semiconductor represented by silicon carbide has great potential application value in the fields of automobile, high-speed rail, energy development and transmission, aerospace industry, ocean development and detection. As a link in the semiconductor manufacturing industry, package connection plays the role of mechanical support, electrical interconnection, electrical conduction and heat conduction, etc., but traditional package connection materials cannot meet high...

Claims

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Application Information

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IPC IPC(8): B23K35/02B23K35/30B23K35/40
CPCB23K35/025B23K35/3006B23K35/302B23K35/40
Inventor 周炜冀志浩郭福王晓露王乙舒汉晶夏志东马立民
Owner BEIJING UNIV OF TECH
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