Packaging process of power electronic transformer based on 3D photocuring printing

A power electronics and packaging technology, applied in inductor/transformer/magnet manufacturing, packaging/impregnation, circuits, etc., can solve the problems of easy cracking of transformers and difficult heat dissipation, reduce the risk of cracking, improve heat dissipation performance, prevent loosening or deformation effect

Active Publication Date: 2022-04-22
HEFEI UNIV OF TECH
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  • Abstract
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  • Application Information

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Problems solved by technology

[0006] Aiming at the deficiencies of the existing technology, the present invention provides a packaging process for power electronic trans

Method used

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Experimental program
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Embodiment

[0050] The present invention provides a packaging process for power electronic transformers based on 3D photo-curing printing. The process includes the following steps:

[0051] S1. Print skeleton network

[0052] According to the size of the transformer core and winding, design the skeleton network, use epoxy resin to print the skeleton network around the transformer core and winding through 3D light curing printing, so as to surround and position the transformer core and winding;

[0053] S2, Pouring

[0054] Put the transformer core and winding with the skeleton network into the mold, and fill the epoxy resin containing the filler into the mold under vacuum;

[0055] S3, applied voltage

[0056] Apply high voltage DC voltage to the transformer winding;

[0057] S4, applying ultrasound

[0058] Apply ultrasonic waves to the cast body;

[0059] S5, current flow

[0060] Pass direct current into the winding;

[0061] S6, thermal curing

[0062] Heat and solidify the po...

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PUM

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Abstract

The invention provides a packaging process of a power electronic transformer based on 3D photocuring printing, and relates to the technical field of transformer packaging. The process comprises the following steps: printing a skeleton network, pouring, applying voltage, applying ultrasonic waves, electrifying, thermally curing and polishing. An epoxy resin printing framework network is adopted to position and fix an iron core and a winding at the first stage of packaging, the winding is effectively prevented from loosening or deforming in the packaging process, epoxy resin containing filler is adopted as a pouring body, the thermal resistance and the expansion coefficient can be remarkably reduced, the heat dissipation performance is improved, and the cracking risk is reduced; the epoxy resin is easy to electrowet a solid in a high-voltage electric field; ultrasonic waves have the characteristic of improving the infiltration capacity, and the infiltration effect of filler-containing resin and a framework network is further improved; the winding is electrified, so that the winding is firstly heated, the casting body is solidified from inside to outside, and external resin is allowed to perform automatic feeding on the shrinkage cavity, so that the internal defects of packaging are remarkably reduced, and the reliability of packaging is improved.

Description

technical field [0001] The invention relates to the technical field of transformer packaging, in particular to a packaging process for power electronic transformers based on 3D photo-curing printing. Background technique [0002] In recent years, the application of power electronics technology in power systems has become more and more extensive and in-depth. The insulation design of high-frequency transformers affects the overall safety, applicability and power density of the transformer, especially for large-capacity high-frequency transformers, which have high voltage levels and put forward higher requirements for insulation design. The stability of the lower insulation has become a research problem. The packaging technology of the module is an important part of the integration of power electronic systems, which may directly affect its electrical performance and thermal performance, so it is of great significance and value to study its packaging method. [0003] With the...

Claims

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Application Information

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IPC IPC(8): H01F41/00
CPCH01F41/005
Inventor 王丽洋赵玉顺豆宏利戴义贤廖呈成孙菲双
Owner HEFEI UNIV OF TECH
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