Batch wafer processing method, etching system and storage medium

A wafer and etching technology, used in electrical components, circuits, semiconductor/solid-state device manufacturing, etc., to solve problems such as inconsistent polymer states, out-of-specification products in reaction chambers, and batch wafer etching rate drift.

Pending Publication Date: 2022-04-22
珠海市艾尔德光通讯技术有限公司
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0005] This application provides a processing method, etching system and storage medium for batch wafers, which can solve the problem of inconsistencies in the state of the polymer deposited in ...

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  • Batch wafer processing method, etching system and storage medium
  • Batch wafer processing method, etching system and storage medium
  • Batch wafer processing method, etching system and storage medium

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Embodiment Construction

[0079] In order to make the purpose, technical solutions and advantages of the application clearer, the following will further describe the implementation of the application in detail in conjunction with the accompanying drawings.

[0080] It should be understood that the "plurality" mentioned in this application means two or more. In the description of this application, unless otherwise specified, " / " means or means, for example, A / B can mean A or B; "and / or" in this article is just a description of the relationship between associated objects, Indicates that there may be three kinds of relationships, for example, A and / or B may indicate: A exists alone, A and B exist simultaneously, and B exists independently. In addition, in order to clearly describe the technical solution of the present application, words such as "first" and "second" are used to distinguish the same or similar items with basically the same function and effect. Those skilled in the art can understand that w...

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PUM

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Abstract

The invention discloses a batch wafer processing method, an etching system and a storage medium, and belongs to the technical field of semiconductor processing. The method comprises the steps of performing wafer-free cleaning on a cavity of a reaction chamber by using a wafer-free cleaning base line before batch wafers are processed, etching a first product wafer in the batch wafers after cleaning, and detecting whether the process performance meets the process specification or not; if not, the cleaning strength of the wafer-free cleaning base line is adjusted, after the adjusted wafer-free cleaning base line is used for conducting wafer-free cleaning on the cavity, a second product wafer is etched, and whether the process performance meets the process specification or not is detected; and if yes, sequentially etching the batch wafers according to the adjusted wafer-free cleaning base line. Thus, the wafer-free cleaning strength can be optimized in advance, polymer deposition of the chamber can be balanced through optimized wafer-free cleaning, the polymer state is kept stable in the batch wafer processing process, and the influence on the etching rate is reduced.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, in particular to a batch wafer processing method, etching system and storage medium. Background technique [0002] In the field of semiconductor processing technology, in order to improve processing efficiency, the same etching process is usually used to continuously process batches of wafers. Wherein, the etching process may adopt a light polymerization etching process or a heavy polymerization etching process. The light polymer etching process refers to an etching process that does not produce polymer deposition during processing, or produces less polymer deposition, and does not affect process performance. The re-polymerization etching process refers to an etching process that produces more polymer deposition during processing, which will affect the process performance. Among them, the typical repolymerization etching process is the Bosch process. [0003] During ...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67069H01L21/67253
Inventor 李忠韩
Owner 珠海市艾尔德光通讯技术有限公司
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