A megasonic cleaning machine for wafer processing

Abstract

The invention discloses a megasonic cleaning machine for wafer processing, comprising a base and a cleaning bin, the top outer side of the base is fixedly installed with the bottom outer side of the cleaning bin, and a cleaning liquid storage tank is fixedly installed inside the base. The invention utilizes fluid mechanics to make the cleaning liquid form two liquid eddy currents on the upper and lower surfaces of the wafer, so that the impurity particles on the wafer surface will be pushed away from the wafer surface by the eddy current of the cleaning liquid, and then move away from the wafer due to the action of inertia and eddy current thrust. The round surface avoids the problem that the impurity particles floating in the cleaning solution will sink to the upper surface of the wafer again due to the oscillation of the super / megasonic wave, which greatly improves the cleaning effect of the wafer, and does not need to flip the wafer again. By performing secondary cleaning, the cleaning time of a single wafer is doubled, which improves the wafer cleaning efficiency. At the same time, it constitutes a cleaning solution recycling system, which reduces the cleaning solution consumption and wafer cleaning costs.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a megasonic cleaning machine for wafer processing. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on the silicon wafer, and become an IC with specific electrical functions. The original material of the product, the wafer is silicon, and the inexhaustible silicon dioxide on the surface of the earth's crust, the silicon dioxide ore is extracted by an electric arc furnace, chlorinated with hydrochloric acid, and distilled to make high-purity polysilicon. [0003] In the prior art, such as the "automatic megasonic semiconductor wafer cleaning equipment" with the Chinese patent number of CN103489814A, it uses the megasonic wave generated by the megasonic generator to enter the meg...

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Problems solved by technology

[0006] The object of the present invention is to provide a kind of megasonic cleaning machine for wafer processing, to solve the use of ultrasonic / megasonic waves proposed in the above-mentioned background technology to clean the wafer surface immersed in the cleaning solution, impurity particles will be affected by the ultrasonic / megasonic waves The wave effect generated in the cleaning liquid keeps floating in the cleaning liquid all the time. When the ultrasonic / megasonic stops working, the floating impurity particles will quickly sink due to their own gravity and adhere to the wafer surface again, resulting in Incomplete removal of impurity particles on the round surface

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