Soldering method of laser circuit board solder paste welding machine

A circuit board and soldering technology, applied in the direction of welding/welding/cutting items, welding equipment, manufacturing tools, etc., can solve the problems of complex production process, unsatisfactory comprehensive energy saving effect, unavoidable baking process of glue and glue curing, etc. , to achieve the effect of improving the yield rate, reducing frequent movement, and reducing system errors

Pending Publication Date: 2022-04-26
惠州一非智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there is also a machine that uses laser spot welding to weld circuit boards with solder wire; it is similar to a laser metal spot welding machine, and the power of the laser tube is generally about 200W. During the production process, it is inevitable to fix the components on the circuit board. The baking process of glue making and glue curing; its comprehensive energy saving effect is not ideal, and the production process is more complicated

Method used

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  • Soldering method of laser circuit board solder paste welding machine
  • Soldering method of laser circuit board solder paste welding machine
  • Soldering method of laser circuit board solder paste welding machine

Examples

Experimental program
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Effect test

Embodiment 1

[0031] Embodiment 1: the concrete structure of the present invention is as follows:

[0032] Please refer to the attached Figure 1-3 , a soldering method of a laser circuit board solder paste soldering machine of the present invention, the soldering method comprises:

[0033] Step 1, take the pre-soldered PCB board, and control the power of the light source between 30 and 100W;

[0034] Step 2, divide the welding surface of the PCB board into a plurality of small area units in the system screen through the control program, and identify the center point of each small area unit;

[0035] Step 3, the control system controls and fixes the table driving mechanism on the PCB, so that the table driving mechanism drives the PCB to move, and moves the center point of one of the small area units to the vertical point of the laser head;

[0036] Step 4, the control system controls the laser head to rotate on the R axis to change the direction of the laser beam to scan in the small are...

Embodiment 2

[0041] Such as Figure 1-10 , figure 1 It is a structural diagram of a pre-soldered PCB board with components in Example 2 of the present invention. figure 2 It is a distribution diagram of each small area unit of a pre-soldered PCB board soldering surface in Embodiment 2 of the present invention.

[0042] figure 2 Among them, the soldering surface of the PCB board is divided into 7 small area units, wherein the first small area unit 1 and the second small area unit 2 have an overlapping area, and the second small area unit 2 is respectively connected with the sixth small area unit 6 and the fifth small area unit. Unit 5 and the third small area unit 3 have an overlapping area, the sixth small area unit 6 and the fifth small area unit 5 have an overlapping area, the fifth small area unit 5 and the third small area unit 3 have an overlapping area, and the fifth small area unit 5 has an overlapping area. The area unit 5 and the fourth small area unit 4 have an overlapping a...

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Abstract

The invention discloses a tin soldering method of a laser circuit board solder paste welding machine, which comprises the following steps of: 1, taking a pre-welded PCB (Printed Circuit Board), and controlling the power of a light source to be 30-100W; step 2, dividing the welding surface of the PCB into a plurality of small area units in the system picture through a control program, and identifying the central point of each small area unit; step 3, the control system controls a table board driving mechanism fixed on the PCB, so that the table board driving mechanism drives the PCB to move, and a central point in one small area unit moves to a vertical point of the laser head; fourthly, the control system controls the laser head to do R-axis rotation so as to change the direction of a laser beam, scanning is conducted in the small area units, and welding is completed; and 5, after welding of one small area unit is completed, the control system controls the table board driving mechanism to move the PCB into the next small area unit. The system error can be reduced, and the tin soldering accuracy is improved.

Description

technical field [0001] The invention relates to a soldering machine, in particular to a soldering method for a laser circuit board soldering machine. Background technique [0002] At present, the known solder paste tinning process for the production and processing of electronic circuit boards all adopts a heating method. This method of heating the entire circuit board not only consumes a lot of energy, but also requires high temperature resistance for the components and parts materials; the present invention You can see an electrolytic capacitor of the same type on the market, and the price of the patch is 2 to 3 times that of ordinary ones. [0003] At present, there is also a machine that uses laser spot welding to weld circuit boards with solder wire; it is similar to a laser metal spot welding machine, and the power of the laser tube is generally about 200W. During the production process, it is inevitable to fix the components on the circuit board. The baking process of...

Claims

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Application Information

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IPC IPC(8): B23K1/005B23K3/08B23K101/36
CPCB23K1/0056B23K3/087B23K2101/36
Inventor 王玲
Owner 惠州一非智能科技有限公司
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