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Manufacturing method of PCIE (Peripheral Component Interface Express) golden finger and electroplated lead structure

A manufacturing method and technology for electroplating leads, which are used in printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of high price, complex lead processing technology, and inability to effectively remove them, and achieve simple structure, workload and difficulty. Effect

Pending Publication Date: 2022-04-26
摩尔线程智能科技(北京)有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, mechanical grinding cannot effectively remove lead residues such as shorter gold fingers in PCIE GEN5 gold fingers, and chemical etching to remove residual leads is complicated and expensive

Method used

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  • Manufacturing method of PCIE (Peripheral Component Interface Express) golden finger and electroplated lead structure
  • Manufacturing method of PCIE (Peripheral Component Interface Express) golden finger and electroplated lead structure
  • Manufacturing method of PCIE (Peripheral Component Interface Express) golden finger and electroplated lead structure

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Embodiment Construction

[0044] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0045] In the description of the embodiments of the present application, it should be understood that terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, acts, components, parts or combinations thereof disclosed in the specification, and do not It is intended to exclude the possibility of the existence of one or more other features, figures, steps, acts, parts, parts or comb...

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PUM

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Abstract

The invention provides a PCIE golden finger manufacturing method and an electroplating lead structure, the method comprises the steps that a golden finger is arranged on a PCB, the golden finger comprises a ground network golden finger and a non-ground network golden finger, and the method comprises the steps that the ground network golden finger is connected with a ground hole located in the first side of the ground network golden finger; a first electroplating bus is arranged on the PCB, and the first electroplating bus transversely connects all the ground holes in the first side of the golden finger together and transversely extends out of the second side edge and / or the third side edge of the PCB; arranging a first electroplating branch line on the PCB, wherein the first electroplating branch line connects a non-ground network golden finger in the golden fingers to the first electroplating bus; electroplating the golden finger by using the first electroplating bus and the first electroplating branch line; and after electroplating is completed, drilling holes in the first electroplating branch lines to cut off the connection between the non-ground network golden fingers and the first electroplating bus. The manufacturing process of the golden finger is simple, and the number of residual leads on the PCB is small.

Description

technical field [0001] The invention belongs to the field of electronic equipment, and in particular relates to a method for manufacturing a PCIE gold finger and an electroplating lead structure. Background technique [0002] This section is intended to provide a background or context to embodiments of the invention that are recited in the claims. The descriptions herein are not admitted to be prior art by inclusion in this section. [0003] Gold finger (connecting finger) refers to many conductive copper sheets made on the top and bottom of the PCB. It is called a gold finger because it is arranged in the shape of a finger. It is used to connect components such as memory sticks and graphics cards to the slot. In order to improve the oxidation resistance of the gold finger and reduce the contact resistance, a layer of gold is electroplated on the surface of the copper sheet. In order to realize gold plating on the gold finger, it is necessary to design a wire on the gold f...

Claims

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Application Information

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IPC IPC(8): H05K3/18H05K1/11
CPCH05K3/18H05K1/117
Inventor 郑夏威
Owner 摩尔线程智能科技(北京)有限责任公司