4results about How to "Understand technical means" patented technology

The present disclosure provides a picture processing method and device, electronic equipment and storage medium, wherein the method comprises: obtaining a source picture with source pixel values and a target picture without target pixel values; splitting the target picture based on a preset split size to obtain a plurality of target sub-pictures; determining a source sub-picture corresponding to the target sub-picture in the source picture based on the target sub-picture, and judging whether the pixel amount contained in the source sub-picture is consistent with a preset threshold; if yes, determining each target pixel value in the target sub-picture based on each source pixel value in the source sub-picture. The present disclosure splits based on the preset split size and then performs picture processing, so that the pixel amount contained in the source sub-picture corresponding to the split target sub-picture can better meet the preset threshold set for SARM, thereby ensuring the conversion relationship between the source picture and the target picture in the case of effective splitting, and the overall picture processing performance is better.

This disclosure provides an entity classification method, apparatus, electronic device, and storage medium. The method includes: acquiring multiple entity relationship networks corresponding to multiple entity nodes; the same entity node corresponding to different entity relationships in different entity relationship networks; performing multi-label prediction on the multiple entity relationship networks based on multiple trained base learners to obtain the multi-label prediction result of each entity node in each entity relationship network; and determining the final multi-label prediction result corresponding to each entity node based on the multi-label prediction result of each entity node in each entity relationship network. This disclosure, from the perspective of multi-view learning, performs multi-label prediction based on multiple entity relationship networks, which can more fully explore the relationships between entities, making the multi-label prediction results for entity nodes more accurate.

This disclosure provides a microphone array noise reduction method, apparatus, system, electronic device, and storage medium. The method includes: acquiring an audio signal to be denoised; performing frequency domain processing on the audio signal to obtain a frequency domain signal; responding to a first sub-frequency domain signal with a frequency less than a preset threshold in the frequency domain signal, performing a first noise reduction process based on a pre-set subtractive microphone array to obtain a denoised first sub-frequency domain signal; responding to a second sub-frequency domain signal with a frequency greater than or equal to a preset threshold in the frequency domain signal, performing a second noise reduction process based on a pre-set additive microphone array to obtain a denoised second sub-frequency domain signal; and obtaining a denoised audio signal based on the denoised first and second sub-frequency domain signals. This disclosure combines the superior characteristics of subtractive and additive microphone arrays to perform targeted noise reduction processing on low-frequency and high-frequency signals respectively, resulting in better noise reduction performance.

The application provides a manufacturing method of a PCIE golden finger and an electroplating lead structure. The method comprises: arranging the golden finger on a PCB board, wherein the golden finger comprises a ground network golden finger and a non-ground network golden finger; connecting the ground network golden finger with a ground hole located on a first side of the ground network golden finger; arranging a first electroplating bus on the PCB board, wherein the first electroplating bus transversely connects all the ground holes on the first side of the golden finger together and extends out of a second side edge and / or a third side edge of the PCB board; arranging a first electroplating branch on the PCB board, wherein the first electroplating branch connects the non-ground network golden finger in the golden finger to the first electroplating bus; electroplating the golden finger by using the first electroplating bus and the first electroplating branch; and drilling a hole on the first electroplating branch to cut off the connection between the non-ground network golden finger and the first electroplating bus after the electroplating is completed. The manufacturing process of the golden finger is simple and the residual lead on the PCB board is less.