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Method and apparatus for locally removing and/or modifying polymer material on surface

A polymer material, local technology, applied in the process of producing decorative surface effects, opto-mechanical equipment, photosensitive material processing, etc., can solve the problem that precise local heating cannot be achieved, and achieve the effect of improving the bonding process

Pending Publication Date: 2022-04-26
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Precise localized heating (in the micrometer range) of the bonded frame is technically impossible

Method used

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  • Method and apparatus for locally removing and/or modifying polymer material on surface
  • Method and apparatus for locally removing and/or modifying polymer material on surface
  • Method and apparatus for locally removing and/or modifying polymer material on surface

Examples

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Embodiment Construction

[0027] Figure 1a and Figure 1b A device according to the invention for locally removing and / or modifying polymer material on the surface of a wafer is shown. The apparatus has an adjustable wafer stage 1 , a mask 2 , a VUV light source 3 , a sealed reaction chamber 5 , a gas inlet 6 , a gas outlet 7 and a gas flow controller 8 . The light source is here a VUV excimer module which is arranged at a distance 4 from the mask 2 . The intermediate space created by the distance 4 can be filled with nitrogen N 2 or another VUV-permeable inert gas. On the opposite side of the mask 2 a wafer W can be arranged on an adjustable wafer table 1 . The wafer W has a polymer coating P on the surface OW opposite the mask 2 .

[0028] Figure 1a The device is shown during a first operating state, ie during exposure. For the exposure, the wafer stage 1 is adjusted with an exposure gap GE (English: gap exposure) between the wafer W and the mask 2 . The intermediate space created by the expos...

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PUM

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Abstract

The invention relates to a method for locally removing and / or modifying polymer material on a surface (WO) of a wafer (W), comprising the following steps: a) orienting a mask (2) relative to the surface (WO); b) locally exposing the surface (WO) through the mask (2) by means of a VUV light source (3), a gas mixture comprising at least oxygen (O2) being supplied at the same time; c) rinsing the surface (WO) with a gas mixture comprising at least nitrogen (N2) and / or oxygen (O2), the VUV light source (3) being switched off; d) repeating at least the steps b) and c) until the removal and / or modification of the polymer material is completed. The invention also relates to a device for locally removing and / or modifying a polymer material (P) on a surface (WO) of a wafer (W), comprising a mask (2) which can be oriented in a defined manner relative to the surface (WO), the surface (WO) being exposed by means of a VUV light source (3) arranged above the mask, a gas mixture containing at least nitrogen (N2) and / or oxygen (O2) can be introduced into an intermediate space between the wafer (W) and the mask (2). The core of the invention is that the device has an adjustable wafer stage (1) for fixing the wafer (W) and is designed to set an exposure gap GE between the wafer (W) and the mask (2) in a first operating state and to set a rinsing gap (GP) between the wafer (W) and the mask (2) in a second operating state, the rinsing gap is larger than the exposure gap (GE).

Description

technical field [0001] The invention relates to a method for locally removing or also modifying polymer material on the surface of a wafer. The invention also relates to a device for locally removing or also modifying polymer material on the surface of a wafer. Background technique [0002] Microelectromechanical (MEMS) sensors, such as acceleration sensors and rotational speed sensors, are encapsulated or capped in order to protect the sensitive movable sensor structure from particles and to provide mold encapsulation for the final product. In addition, the cover enables operation of the sensor under defined pressure conditions. Capping is achieved by bonding the lid wafer to the sensor wafer. Each of the mentioned wafers undergoes a series of technological steps in order to provide the desired sensor structure. Before the bonding process, the wafer is coated with an anti-stick coating (English: Anti-Stiction Coating) provided for the movable MEMS structures and a corres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/36G03F7/40G03F7/42H01L21/311H01L21/67B81C1/00
CPCG03F7/36G03F7/40G03F7/427H01L21/31138H01L21/67028H01L21/67069B81C1/00547B81C1/00849B81C2201/112B81C2203/0118B81C1/00476B81C2201/11
Inventor R·萨莫拉J·布茨T·屈恩B·威尔
Owner ROBERT BOSCH GMBH
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