Micro component carrying device for chip processing

Abstract

The invention provides a micro element carrying device for chip processing, and relates to the field of chips. The micro element carrying device for chip processing comprises a center shaft, the left side of the center shaft is fixedly connected with a stabilizing disc, an inner groove of the stabilizing disc is fixedly connected with a suction sleeve, the right side of the center shaft is rotationally connected with a grabbing disc, the suction sleeve is fixedly connected to an inner groove of the grabbing disc, and the upper end of the stabilizing disc is fixedly connected with a grabbing motor; the output end of the grabbing motor is fixedly connected with pushing teeth, the peripheral faces of the pushing teeth are meshed with gear rings, and the gear rings are rotationally connected with the center shaft. According to the micro element carrying device for chip processing, an element actively gets close to the device by adopting an air suction cup, damage to the element and a main board caused by pressing is avoided, a suction sleeve is installed in the suction cup to prevent the micro element from being sucked into the device, and the suction cup is still effective for the small element; and the effect of grabbing the elements without damaging the elements is achieved, and the problem that grabbing and pressing are prone to damaging the elements is solved.

Description

technical field [0001] The invention relates to the field of chips, in particular to a tiny component handling device for chip processing. Background technique [0002] An integrated circuit is a way to miniaturize a circuit. It uses a certain process to interconnect components such as transistors, resistors, capacitors, and inductors required in a circuit, and interconnects them together, and makes them on a small or several small semiconductor chips or dielectric substrates. On-chip, and then packaged in a package to become a micro-structure with the required circuit functions; all the components have been structurally integrated, making electronic components towards miniaturization, low power consumption, intelligence and high reliability. A big step forward. [0003] Chips are usually connected in the form of patches due to the small overall components during processing. However, it is often impossible to assemble them in place at one time during assembly. At this time,...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a micro-component handling device for chip processing, which solves the problems that the components are easily damaged by grasping and pressing, the components are irregular in shape and cannot be adsorbed, and different components need different forces to be transported. question

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