FinFET high-density novel memory and preparation method thereof
A memory and high-density technology, applied in the fields of electric solid-state devices, semiconductor devices, Hall effect devices, etc., can solve the problems of large device occupation area and low data storage density, and achieve higher integration, higher storage density, and simpler methods. easy effect
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[0041] The specific embodiment of the present invention provides a new FinFET high-density memory, which is composed of multiple memory cells on the substrate layer 101 . Such as figure 1 As shown, each memory cell includes: a current writing layer 1021, two magnetic tunnel junctions 1121 and 1122 with the same structure located on both sides of the current writing layer; as shown in the figure, the magnetic tunnel junctions 1121 respectively include The free layer 1031, the barrier layer 1041, the artificial antiferromagnetic coupling layer 1051, and the covering layer 1061, and the two magnetic tunnel junctions 1121 and 1122 are respectively located on both sides of the current writing layer 1021 to form a symmetrical structure;
[0042] The artificial antiferromagnetic coupling layer 1051 includes a pinned layer 1052 , an antiferromagnetic coupling layer 1053 , and a pinning layer 1054 .
[0043] In this embodiment, the provided substrate layer 101 is a complementary metal...
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