Palladium alloy bottom column head processing device for test probe

Abstract

The invention relates to the technical field of machining devices, in particular to a palladium alloy bottom column head machining device for a test probe, and provides the following scheme that the palladium alloy bottom column head machining device comprises a base, a first air cylinder and a supporting plate are fixedly connected to the top face of the base, a second drilling device is arranged at the top end of the first air cylinder, and a supporting rod is fixedly connected to one side of the supporting plate; a second air cylinder is arranged below the supporting rod, a first drilling device is fixedly connected to the bottom end of the second air cylinder, a clamping device located between the first drilling device and the second drilling device is arranged on the base, and a fixing plate fixedly connected with the base is arranged on the side, away from the supporting plate, of the first air cylinder. A second rack is fixedly connected to the side, close to the first air cylinder, of the fixing plate, a sliding block is slidably connected to one side of the second rack, a rotatable electromagnetic coil and a sealing mechanism are arranged at the bottom of the sliding block, and the electromagnetic coil and the sealing mechanism are both located between the clamping device and the first drilling device. According to the drilling device, the purpose of drilling the bottom column body is achieved.

Description

technical field [0001] The invention relates to the field of processing devices, in particular to a palladium alloy bottom post head processing device for test probes. Background technique [0002] Semiconductor chips: Etching and wiring on semiconductor sheets to make semiconductor devices that can achieve certain functions, not only silicon chips, but also gallium arsenide (gallium arsenide is poisonous, so some inferior circuit boards do not Curious to break it down), germanium and other semiconductor materials. [0003] After the semiconductor chip is produced, it needs to be randomly sampled and inspected. The performance of the semiconductor chip is generally tested through a probe. Another conductive metal is used to contact the bottom post head to transmit the test signal. However, the probe of this method often causes chip damage due to excessive force (lack of buffer settings) during testing. At the same time, two different The signal transmission between conduct...

AI Technical Summary

Problems solved by technology

[0003] After the semiconductor chip is produced, it needs to be randomly sampled and inspected. The performance of the semiconductor chip is generally tested through a probe. Another conductive metal is used to contact the bottom post head to transmit the test signal. However, the probe of this method often causes chip damage due to excessive force (lack of buffer settings) during testing. At the same time, two different The signal transmission between conductors and metals will be affected. Therefore, it is necessary to design a palladium alloy bottom column head made of the same material as the conductor and the test body and have a buffering effect, and a special processing device needs to be set up to process this type of bottom column head. For this reason, this The invention proposes a palladium alloy bottom column head processing device for test probes

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