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Electronic product comprehensive stress dust test evaluation method

A technology of comprehensive stress and electronic products, applied in the field of reliability testing, can solve problems such as accelerated metal corrosion and electrical conductivity, and achieve the effects of product reliability, broad application prospects, and accurate and reliable evaluation results

Active Publication Date: 2022-05-10
58TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, dust deposited on the surface of an insulator is a poor conductor; however, when combined with other environments such as temperature and humidity, it will dissolve soluble particles to form an electrolyte, thereby accelerating the corrosion of metal corrosion and the change of electrical conductivity

Method used

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  • Electronic product comprehensive stress dust test evaluation method
  • Electronic product comprehensive stress dust test evaluation method
  • Electronic product comprehensive stress dust test evaluation method

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Embodiment Construction

[0032] A comprehensive stress sand dust test evaluation method for electronic products proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific examples. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0033] The invention provides a comprehensive stress sand dust test evaluation method for electronic products, the process of which is as follows figure 1 shown, including the following steps:

[0034] Step S11: Carry out research and information collection on the actual application environment of the electronic product to be evaluated, and conduct classified statistical analysis on the relevant data;

[0035] Among them, th...

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Abstract

The invention discloses an electronic product comprehensive stress dust test evaluation method, and belongs to the field of reliability test. The method comprises the following steps: firstly, carrying out investigation and information collection on an actual application environment of a to-be-evaluated electronic product, and carrying out classified statistical analysis on related data; secondly, according to a data analysis result in the first step, comprehensive stress sand and dust test severity selection and test profile design are carried out; then, according to the test conditions and the profile designed in the step 2, specific implementation of the test and monitoring of key parameters are carried out; and finally, carrying out performance characterization test and risk grade judgment on the test sample. Based on the actual application environment characteristics of the product, the temperature stress and sand dust comprehensive stress condition is introduced, and the risk grade of the product is evaluated under the temperature and humidity conditions, so that the application environment of the product can be simulated more appropriately, and the reliability of the electronic product under the comprehensive sand dust stress condition is evaluated more perfectly.

Description

technical field [0001] The invention relates to the technical field of reliability testing, in particular to an electronic product comprehensive stress dust test evaluation method. Background technique [0002] With the continuous development of the level of industrialization and the continuous deterioration of the natural environment, the dust environment has further increased the impact on the service life and reliability of electronic products. The intrusion of sand and dust may cause electronic products to have harmful effects such as stuck moving parts, abrasive moving parts, changes in contact resistance and insulation properties, reduced thermal conductivity, increased noise, lubricant contamination, and changes in optical properties. [0003] Sand and dust intrusion into electronic products is due to the deposition of its own gravity, the introduction of air thermal movement, and the inhalation caused by inconsistent air pressure due to temperature changes. Generall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D21/02
CPCG01D21/02
Inventor 江徽万永康刘信何静虞勇坚张凯虹
Owner 58TH RES INST OF CETC
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