Polishing device with cooling function

Abstract

According to the polishing device with the cooling function, a polishing disc is provided with a first disc body and a second disc body which are connected in an up-down attached mode, and an avoiding hole for a sensor to penetrate through is formed in the second disc body; the rotating shaft is connected to the second disc body and used for driving the polishing disc to rotate. The cooling loop is spirally coiled between the first disc body and the second disc body, and cooling liquid can circulate in the cooling loop; a liquid inlet/return port of the cooling loop is communicated with a hose, and the hose penetrates through the shaft penetrating hole of the rotating shaft and then is suitable for being communicated with a cooling liquid tank; the avoiding hole is lapped by the cooling loop, and cooling liquid firstly flows through the cooling loop lapped in the circumferential direction of the avoiding hole; the driving assembly is at least partially arranged on the rotating shaft and used for driving the rotating shaft to rotate. According to the cooling loop, the polishing disc can be circularly cooled, and the influence of heat on the chemical reaction of the polishing liquid is reduced; and the avoiding hole is wrapped by the cooling loop, so that the sensor can be fully cooled, and the problem of non-uniform heat dissipation caused by installation of the sensor is reduced.

Description

technical field [0001] The invention relates to the technical field of polishing machines, in particular to a polishing device with a cooling function. Background technique [0002] In the field of chemical mechanical polishing technology, the wafer is clamped at the lower end of the rotating polishing head, the upper end of the rotating polishing disc is provided with a polishing pad, and a polishing liquid is provided between the wafer on the polishing head and the polishing pad. Under the action, the wafer achieves global planarization. [0003] During the polishing process, the polishing disc and the driving motor that drives the polishing disc will generate a lot of heat; on the one hand, the heat will cause thermal deformation of the workpiece, which will affect the polishing quality of the wafer; on the other hand, the heat will affect the polishing liquid to a certain extent. The chemical reaction will affect the polishing effect of the wafer, so cooling measures mu...

AI Technical Summary

Problems solved by technology

[0003] During the polishing process, the polishing disc and the driving motor that drives the polishing disc will generate a lot of heat; on the one hand, the heat will cause thermal deformation of the workpiece, which will affect the polishing quality of the wafer; on the other hand, the heat will affect the polishing liquid to a certain extent. Chemical reaction, which affects the polishing effect of the wafer, so cooling measures must be taken to control the temperature of the polishing disc

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