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Preparation method of grinding block and grinding wheel for grinding semiconductor plastic package body

A grinding block and semiconductor technology, applied in grinding/polishing equipment, abrasives, grinding devices, etc., can solve the problems of high price of grinding wheels, scratches on product surfaces, and high production costs for customers, so as to improve the effective use time and reduce Grinding wheel cost, the effect of reducing customer production cost

Inactive Publication Date: 2022-05-13
西安易星新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] At present, the common problem of the imported plastic-encapsulated grinding wheels used in the market is that the surface of the product is scratched during the grinding process, resulting in a short service life of the grinding wheel, and the price of the grinding wheel is high, resulting in high production costs for customers and affecting product competitiveness.

Method used

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  • Preparation method of grinding block and grinding wheel for grinding semiconductor plastic package body
  • Preparation method of grinding block and grinding wheel for grinding semiconductor plastic package body
  • Preparation method of grinding block and grinding wheel for grinding semiconductor plastic package body

Examples

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preparation example Construction

[0042] refer to Figure 1-8 , the present embodiment provides a method for preparing a grinding block for grinding a semiconductor plastic package, comprising the following steps:

[0043] 1) raw material drying; place the vitrified bond, diamond powder and pore-forming agent aluminum oxide hollow balls in a drying oven to dry;

[0044] 2) diamond powder sieving; select a screen cloth with two standard grades larger than the selected diamond powder particle size, and use a vibrating sieving machine to sieve the diamond powder to remove large-grain diamonds in the diamond powder;

[0045] 3) batching; take by weight 35-50% vitrified bond, 35-50% diamond powder, 10-20% aluminum oxide hollow spheres and 5-10% for wetting vitrified bond The auxiliary agent is put into the mixing tank and then put into the three-dimensional mixing machine to fully mix evenly to obtain the raw material mixture;

[0046] 4) Compression molding: Measure the raw material mixture, pour it into the gri...

Embodiment 1

[0057] This embodiment provides a method for preparing a grinding block for grinding a semiconductor plastic package, comprising the following steps:

[0058] 1) raw material drying; place vitrified bond, diamond powder and pore-forming agent aluminum oxide hollow balls in a drying oven for 12 hours at 85°C; wherein, vitrified bond includes 65% silicon dioxide, 10% boron trioxide, 10% alumina, 5% calcium oxide, 5% sodium oxide and 5% magnesium oxide, the particle size of the vitrified bond is 15μm; the diamond powder is 1300 mesh raw polycrystalline diamond ; The inner diameter of the pore-forming agent alumina hollow sphere is 50 μm, and the wall thickness is 3 μm;

[0059] 2) diamond powder sieving; select a 1000-mesh sieve, and use a vibration sieving machine to sieve the diamond powder 3 times to remove large-grain diamonds in the diamond powder;

[0060] 3) batching; take by weight 40% vitrified bond, 40% diamond powder, 15% aluminum oxide hollow spheres and 5% auxiliary...

Embodiment 2

[0081] This embodiment provides a method for preparing a grinding block for grinding a semiconductor plastic package, comprising the following steps:

[0082] 1) raw material drying; place vitrified bond, diamond powder and pore-forming agent aluminum oxide hollow balls in a drying oven and dry at 100°C for 10 hours; wherein, vitrified bond includes 62% silicon dioxide, 12% boron trioxide, 8% aluminum oxide, 5% calcium oxide, 5% sodium oxide and 5% magnesium oxide, the particle size of the vitrified bond is 15 μm; the diamond powder is 1200 mesh raw polycrystalline diamond ; The inner diameter of the pore-forming agent alumina hollow sphere is 40 μm, and the wall thickness is 5 μm;

[0083] 2) diamond powder sieving; the selection specification is 800 mesh, and the diamond powder is sieved 3 times by a vibrating sieving machine to remove large-grained diamonds in the diamond powder;

[0084] 3) batching; take by weight 42% vitrified bond, 40% diamond powder, 12% aluminum oxid...

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Abstract

The invention discloses a preparation method of a grinding block and a grinding wheel for grinding a semiconductor plastic package body, and the preparation method of the grinding block for grinding the semiconductor plastic package body comprises the following steps: 1) drying raw materials; 2) screening the diamond powder; 3) burdening; (4) compression molding; 5) heat treatment and deburring; and (6) grinding block sintering. The preparation method of the grinding wheel for grinding the semiconductor plastic package body comprises the following steps: 1) bonding and fine trimming; the grinding block prepared through the method is bonded to an aluminum alloy base body matched with the grinding block in size through AB glue, and the grinding wheel is obtained; 2) testing dynamic balance; 3) cleaning; (4) inspecting; and 5) marking and packaging. According to the grinding wheel prepared through the method, in the grinding process, the surface of the product is not scratched, so that the service life of the grinding wheel is prolonged, the production cost of customers is reduced, and industrial application of the grinding wheel product is achieved.

Description

technical field [0001] The invention relates to semiconductor processing technology, in particular to a preparation method of a grinding block and a grinding wheel for grinding a semiconductor plastic package. Background technique [0002] Electronic packaging is an important part of the semiconductor industry. It is in the back-end process of the semiconductor industry. The main processes are wafer back grinding, wafer saw, die attach, and wire bonding. Wire bond, Compound molding, Compound grinding, Compound singulation, Marking, Testing, etc. Among them, the basic method of grinding the plastic package is to install the special grinding wheel on the automatic precision grinding machine, and use the grinding wheel to grind off the excess material on the back of the plastic package according to the requirements to achieve the desired thickness, while ensuring the surface roughness and smoothness of the grinding surface. . Due to the different models and thicknesses of pla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/14B24D18/00
CPCB24D3/14B24D18/0009
Inventor 殷攀峰
Owner 西安易星新材料有限公司
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