Ceramic-based diamond grinding wheel for grinding semiconductor plastic package body and manufacturing method of ceramic-based diamond grinding wheel

A manufacturing method and technology of plastic packaging, applied in the direction of ceramic products, manufacturing tools, abrasives, etc., can solve the problems of low service life of grinding wheels, low surface finish of products, etc., and achieve the effect of avoiding scratches

Inactive Publication Date: 2022-04-26
西安易星新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a vitrified diamond grinding wheel for semiconductor plastic package grinding and its manufacturing method, so as to solve the problems of low product surface finish and low grinding wheel life when the existing grinding wheel is used

Method used

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  • Ceramic-based diamond grinding wheel for grinding semiconductor plastic package body and manufacturing method of ceramic-based diamond grinding wheel
  • Ceramic-based diamond grinding wheel for grinding semiconductor plastic package body and manufacturing method of ceramic-based diamond grinding wheel
  • Ceramic-based diamond grinding wheel for grinding semiconductor plastic package body and manufacturing method of ceramic-based diamond grinding wheel

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Embodiment Construction

[0047] The specific content of the present invention will be further explained in detail below in conjunction with the examples.

[0048] The vitrified diamond grinding wheel for grinding semiconductor plastic package of the present invention is composed of an aluminum alloy substrate and a grinding block bonded on the aluminum alloy substrate;

[0049] The grinding block is composed of 35-50% vitrified bond, 35-50% diamond powder, 10-20% pore-forming agent and 5-10% auxiliary agent in mass percentage, after mixing, compression molding, heat treatment and Obtained after sintering treatment; wherein, the vitrified bond has a particle size of 10-50 μm, and the vitrified bond includes 50-70% silicon dioxide, 5-15% diboron trioxide, 5-15% aluminum oxide, 5-10 % Calcium Oxide, 1-5% Sodium Oxide and 1-5% Magnesium Oxide. The diamond powder is sieved polycrystalline diamond powder with a particle size of 5-50 μm. The type of pore-forming agent is silica ball or acrylic, the particl...

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Abstract

The invention discloses a ceramic-based diamond grinding wheel for grinding a semiconductor plastic package body and a manufacturing method of the ceramic-based diamond grinding wheel. The ceramic-based diamond grinding wheel is composed of an aluminum alloy base body and a grinding block bonded to the aluminum alloy base body. The grinding block is prepared from the following components in percentage by mass: 35-50% of a ceramic bond, 35-50% of diamond powder, 10-20% of a pore forming agent and 5-10% of an auxiliary agent through mixing, compression molding, heat treatment and sintering treatment, it is effectively guaranteed that the grinding wheel does not scratch the surface of a product in the using process, the yield is improved, and the product cost of customers is reduced; according to the grinding wheel manufactured by adopting the formula and the process, the service life of the grinding wheel can be effectively prolonged, the replacement period of the grinding wheel is prolonged, the time for replacing the grinding wheel is saved, the production cost of a single product of a customer is reduced, and the product competitiveness is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and relates to a ceramic-based diamond grinding wheel for grinding a semiconductor plastic package and a manufacturing method thereof. Background technique [0002] The semiconductor industry as a whole can be divided into three parts: wafer design, wafer manufacturing, and wafer package and test. Among them, although wafer packaging and testing is in the back-end process of the semiconductor industry, it plays an important role in linking the past and the future with respect to terminal application products. It can not only ensure the normal electrical connection of the chip, but also protect the chip surface from external forces. damage and the influence of the external environment. [0003] The main processes of packaging and testing are wafer back grinding, wafer sawing, die attach, wire bonding, compound molding, and compound grinding. grinding), compound singulation, m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/18B24D3/34B24D18/00C04B35/528C04B35/63C04B38/00C04B38/06
CPCB24D3/18B24D3/342B24D18/0009C04B35/528C04B35/6316C04B38/0041C04B38/067C04B2235/427C04B2235/3418C04B2235/3409C04B2235/3217C04B2235/3208C04B2235/3201C04B2235/3206C04B2235/6562C04B2235/6567C04B2235/96C04B38/0054C04B38/0074
Inventor 殷攀峰
Owner 西安易星新材料有限公司
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