Micro-mechanical film structure of MEMS device and MEMS device

Abstract

The invention discloses a micro-mechanical thin film structure of an MEMS device and the MEMS device. The micro-mechanical thin film structure comprises a substrate; the anchor point seat is arranged on the substrate; the elastic thin film assembly comprises a thin film piece and a stress absorbing piece, the stress absorbing piece is arranged on the thin film piece to absorb stress causing creep deformation of the thin film piece, and one of the thin film piece and the stress absorbing piece is arranged on the anchor point seat. According to the invention, the stress absorbing part is arranged to absorb the stress causing creep deformation of the thin film part, so that the concentrated stress on the elastic thin film assembly is released or homogenized, the creep resistance is improved, and the performance of the MEMS device is prevented from drifting.

Description

technical field [0001] The invention relates to the field of components of MEMS devices, in particular to a micromechanical thin film structure of the MEMS device and the MEMS device. Background technique [0002] Micromechanical thin film structures are typical components in MEMS (microelectromechanical systems) devices, and are often used for structural actuation, signal sensing, etc. Micromechanical thin film structures are generally composed of metal materials or non-metal materials. For these materials (especially metal materials), under the condition of mechanical stress during operation, due to their creep characteristics, MEMS devices will gradually produce irreversible deformation. , so that the performance of the MEMS device will drift, and even cause the failure of the MEMS device in severe cases. [0003] In order to alleviate the creep deterioration of the structure, the industry generally uses high-strength creep-resistant new materials to improve performance;...

AI Technical Summary

Problems solved by technology

Micromechanical thin film structures are generally composed of metal materials or non-metal materials. For these materials (especially metal materials), under the condition of mechanical stress during operation, due to their creep characteristics, MEMS devices will gradually produce irreversible deformation. , so that the performance of MEMS devices will drift, and in severe cases, it will even cause MEMS devices to fail

[0003] In order to alleviate the creep deterioration of the structure, the industry generally uses high-strength creep-resistant new materials to improve performance; however, this method requires the development and evaluation of new materials, which has a long cycle and high risk, and the development results are somewhat unpredictable

Images