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Lead frame structure and method for improving layering of pins of semiconductor device

A lead frame and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid device manufacturing, semiconductor/solid device components, etc., can solve unsatisfactory problems, reduce delamination, improve product reliability, and increase adhesion Effect

Pending Publication Date: 2022-05-13
XIAN LONTEN RENEWABLE ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, for industrial-grade and automotive-grade product packaging, the pin layering requirement is 0, and the ordinary lead frame packaging used by the packaging factory cannot meet this requirement

Method used

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  • Lead frame structure and method for improving layering of pins of semiconductor device
  • Lead frame structure and method for improving layering of pins of semiconductor device
  • Lead frame structure and method for improving layering of pins of semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] see figure 1 , the pin size of the lead frame in the figure is relatively large, and there is a small hole on both sides of the pin, that is, the locking hole 4 . The size of the small hole can be determined according to the size of the pin under the condition of ensuring that the continuous flow bonding required by the product and the strength around the small hole of the lead frame pin are met.

Embodiment 2

[0022] see figure 2 , the pin size of the lead frame in the figure is small, and it also includes a mounting hole 6, and a locking hole 4 can be made at the lead connection under the pin to achieve the purpose of improving the layering of the pin.

[0023] figure 1 and figure 2 Among them, different lead frames have different hole sizes, but all of them can achieve the purpose of improving pin layering.

[0024] The small holes provided on the lead frame of the present invention can increase the bonding force between the pins of the lead frame and the plastic encapsulation compound, release the stress in the wiring area of ​​the pins, and further reduce the delamination of the pins of the lead frame.

[0025] The layering of lead frame pins is reduced, the product yield rate is improved, and the product reliability is improved.

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Abstract

The invention discloses a lead frame and a method for improving a pin layering structure of a semiconductor device, and solves the problem that when a common lead frame is packaged, the requirement that the pin layering is zero cannot be met. According to the specific technical scheme, the lead frame for improving the layering of the base pins of the semiconductor device comprises a base island and the base pins, and is characterized in that the base pins are provided with a plurality of small holes; the two sides of each pin are respectively provided with a small hole, or a small hole is formed in the connecting position of the lower sides of the pins. According to the invention, the stress of the pin routing area is reduced by improving the lead frame, the cohesiveness of the molding compound and the frame is increased, the purpose of reducing layering is achieved, the electrical performance of the product is improved, and the reliability of the product is further improved.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging and testing, and relates to a lead frame and a method for improving the layered structure of semiconductor device pins. Background technique [0002] Since the emergence of epoxy molding compound (EMC), it has gradually replaced ceramic and metal packaging with its advantages of high reliability, low cost, and simple process. After going through a high-temperature and high-humidity environment, the expansion of moisture will cause excessive internal stress and form stratification. Delamination will cause water vapor to enter the product, environmental tests such as PCT / THT / HAST will cause product failure, and failure modes such as "popcorn effect" will appear on the machine. [0003] Delamination refers to the phenomenon that different substances are separated and gapped at the contact surface, leading to the entry of air, water or acid and alkali, resulting in electrical performance failur...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L21/48
CPCH01L23/4952H01L23/49544H01L21/4821
Inventor 王飞王荣华张园园张锴
Owner XIAN LONTEN RENEWABLE ENERGY TECH