Integrated brain electrode structure and preparation method thereof
A brain electrode and electrode technology, applied in the field of integrated brain electrode structure and its preparation, can solve the problems of large area, unfriendly experimental operation, difficulty in taking into account small size, high flexibility, etc., achieve large flux, avoid electrode structure The effect of poor adhesion
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preparation example Construction
[0071] refer to Figure 5 , Figure 5 It is a flow chart of preparation of an optional brain electrode structure in this application. On the other hand, the present application also discloses a method for preparing an integrated brain electrode structure, which includes:
[0072] 1) provide a silicon substrate 11, refer to Figure 5 Figure (a) in.
[0073] 2) Prepare a sacrificial layer 12 on the silicon substrate 11 .
[0074] Optionally, the material of the sacrificial layer 12 may be aluminum, with a thickness of 0.5-2 microns.
[0075] Optionally, in step 2), the sacrificial layer 12 (such as Figure 5 As shown in Figure (b) in ), and then graph the sacrifice, so as to obtain the Figure 5 The structure shown in panel (c) in .
[0076] 3) prepare flexible substrate layer 6 on this sacrificial layer 12, refer to Figure 5 Figure (d) in.
[0077] Optionally, the material of the flexible substrate layer 6 can be polyimide with good biocompatibility.
[0078] 4) Form...
Embodiment example 1
[0092] The brain electrode structure prepared by the above preparation method can be used for acute EEG signal acquisition, such as Figure 7 as shown, Figure 7 An optional brain electrode structure application scene diagram provided for this application. The brain electrode structure is placed on the cerebral cortex, wherein the slender connecting wire 52 can be buried under the skin until it is hung behind the ear or to the clavicle, and the pad structure 10 is connected to the lead wire 3, and the lead wire 3 is connected to the signal The acquisition device 4 is connected.
Embodiment example 2
[0094] The integrated brain electrode structure prepared according to the aforementioned manufacturing process can be implanted in the body for a long time to collect signals in the corresponding area, see Figure 8 , Figure 8 Another optional brain electrode structure application scene diagram provided for this application. The brain electrode structure is placed on the area of the brain to be collected, the connection structure 8 is buried under the skull, and then connected to the pad structure 10 through the skull. The pad structure 10 can be fixed in the base of the skull, and is small and light. The pad structure 10 is connected to the lead wire 3 , and the lead wire 3 is connected to the signal acquisition device 4 .
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