Epoxy resin composition for diffusion plate, prepreg and preparation method and application thereof

A technology of epoxy resin and prepreg, which is applied in sustainable biological treatment, instruments, diffusing elements, etc., can solve the problems of poor mechanical properties of plates, high production costs, complex processes, etc. Loss, the effect of expanding the luminous surface

Pending Publication Date: 2022-05-27
GUANGDONG HINNO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In summary, the thermoplastic matrix diffuser plate prepared by the existing technology has the defects of complicated process, high production cost, low transmittance, and poor mechanical properties of the plate. It is urgent to develop a new type of epoxy resin diffuser plate to solve the existing problems.

Method used

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  • Epoxy resin composition for diffusion plate, prepreg and preparation method and application thereof
  • Epoxy resin composition for diffusion plate, prepreg and preparation method and application thereof
  • Epoxy resin composition for diffusion plate, prepreg and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] (1) Preparation of prepreg

[0046] Add 3 parts of dicyandiamide and 30 parts of N,N-dimethylformamide into the batching bottle ① and fully stir to dissolve, then add 5 parts of polyethylene powder and 0.1 part of sodium pyrophosphate in turn, and disperse at high speed for 0.5h; 40 parts of Add bisphenol A epoxy resin into batching bottle ②, add 5 parts of core-shell resin under stirring conditions, and after high-speed dispersion for 2 hours, add all the composition in batching bottle ② into batching bottle ①, and add in sequence under stirring conditions 0.03 part of 2-methylimidazole and 10 parts of nano-silicon dioxide were stirred evenly to prepare an epoxy resin composition for diffusion plate. Impregnated 1080 glass fiber cloth (basic weight 48g / m) with the epoxy resin composition for diffuser plate 2 ), and baked in a hot air circulating oven at 180° C. for 5 min to obtain a prepreg with a resin content of 71%.

[0047] (2) Preparation of diffuser plate

[0...

Embodiment 2

[0050] (1) Preparation of prepreg

[0051] Add 3 parts of dicyandiamide and 30 parts of N,N-dimethylformamide into the batching bottle ① and fully stir to dissolve, then add 5 parts of polyethylene powder and 0.1 part of sodium pyrophosphate in turn, and disperse at high speed for 0.5h; 50 parts of Add bisphenol A epoxy resin into batching bottle ②, add 5 parts of core-shell resin under stirring conditions, and disperse at high speed for 2 hours, add all the composition in batching bottle ② into batching bottle ①, and add in sequence under stirring conditions 0.03 part of 2-methylimidazole and 10 parts of nano-silicon dioxide were stirred evenly to prepare an epoxy resin composition for diffusion plate. Impregnated 1080 glass fiber cloth (basic weight 48g / m) with the epoxy resin composition for diffuser plate 2 ), and baked in a hot air circulating oven at 180° C. for 5 min to obtain a prepreg with a resin content of 71%.

[0052] (2) Preparation of diffuser plate

[0053] ...

Embodiment 3

[0055] (1) Preparation of prepreg

[0056] Add 3 parts of dicyandiamide and 30 parts of N,N-dimethylformamide into the batching bottle ① and stir to dissolve, then add 5 parts of polyethylene powder and 0.1 part of sodium pyrophosphate in sequence, and disperse at high speed for 0.5h; 60 parts of Add bisphenol A epoxy resin into batching bottle ②, add 5 parts of core-shell resin under stirring conditions, and after high-speed dispersion for 2 hours, add all the composition in batching bottle ② into batching bottle ①, and add in sequence under stirring conditions 0.03 part of 2-methylimidazole and 10 parts of nano-silicon dioxide were stirred evenly to prepare an epoxy resin composition for diffusion plate. Impregnated 1080 glass fiber cloth (basic weight 48g / m) with the epoxy resin composition for diffuser plate 2 ), and baked in a hot air circulating oven at 180° C. for 5 min to obtain a prepreg with a resin content of 70%.

[0057] (2) Preparation of diffuser plate

[005...

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Abstract

The invention discloses an epoxy resin composition for a diffusion plate, a prepreg and a preparation method and application thereof. The epoxy resin composition for the diffusion plate comprises the following components in parts by mass: 40-80 parts of matrix resin, 5-15 parts of core-shell resin, 5-15 parts of organic particles, 10-30 parts of nanoscale filler, 0.1-0.3 part of a dispersing agent, 2-4 parts of a curing agent and 0.01-0.05 part of an accelerant. The optical properties of a prepreg and a diffusion plate which are further prepared from the epoxy resin composition for the diffusion plate prepared from the raw materials are remarkably improved, meanwhile, the mechanical properties are also greatly improved, and the epoxy resin composition has a good application prospect.

Description

technical field [0001] The invention relates to the field of organic materials, in particular to an epoxy resin composition for a diffusion plate, a prepreg and a preparation method and application thereof. Background technique [0002] At present, the commonly used substrates for light diffusers are: thermoplastic materials such as PMMA, PC, PS, and PP. The traditional diffuser plate mainly adds chemical particles to the diffuser plate substrate as scattering particles, so that the light is continuously refracted, reflected and scattered in two media with different refractive indices when passing through the scattering layer, thereby generating optical diffusion. In this way, the absorption of light by diffused particles will inevitably exist, resulting in low utilization of light energy. [0003] Thermoplastic materials used to make diffuser plates also have the problems of low glass transition temperature, narrow applicable temperature range, poor mechanical properties a...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L51/04C08L23/06C08K3/36C08K7/14C08J5/24G02B5/02
CPCC08L63/00C08J5/24G02B5/0236C08L2207/53C08K2201/011C08J2363/02C08J2451/04C08L51/04C08L23/06C08K3/36C08K7/14Y02W10/10
Inventor 张新权余家斌漆小龙
Owner GUANGDONG HINNO TECH CO LTD
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