Unlock instant, AI-driven research and patent intelligence for your innovation.

Packaging method of ceramic shell and ceramic shell

A technology of ceramic packaging and ceramic casing, which is applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of complex ceramic casing packaging process, and achieve the effect of convenient processing, simple manufacturing process and cost reduction.

Pending Publication Date: 2022-06-03
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a packaging method of a ceramic shell and a ceramic shell to solve the problem of complicated packaging process of the current ceramic shell

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging method of ceramic shell and ceramic shell
  • Packaging method of ceramic shell and ceramic shell
  • Packaging method of ceramic shell and ceramic shell

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In the following description, for the purpose of illustration rather than limitation, specific details such as specific system structures and technologies are set forth in order to provide a thorough understanding of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0032] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following descriptions will be given through specific embodiments in conjunction with the accompanying drawings.

[0033] As described in the background art, different types of chips and electronic components need to be integrated in the ceramic cavity of the p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a packaging method of a ceramic shell and the ceramic shell, and the packaging method of the ceramic shell comprises the steps: providing a ceramic packaging base which is provided with a cavity for device packaging, and the bottom of the cavity is provided with a plurality of preset areas; a low-resistance sheet matched with the preset area in shape is manufactured, and the thickness of a plating layer on the low-resistance sheet is matched with the requirement of the preset area for the thickness of the plating layer of the low-resistance sheet; fixing the corresponding low-resistance sheet in a preset area of the ceramic packaging base, and mounting and bonding an electronic component to be packaged; and performing cover plate sealing on the ceramic packaging base. The packaging method of the ceramic shell provided by the invention is simple in manufacturing process and convenient to process.

Description

technical field [0001] The invention relates to the technical field of ceramic shell packaging, in particular to a packaging method for a ceramic shell and a ceramic shell. Background technique [0002] System-in-package refers to the integration of multiple functional wafers, such as processors, memory and other functional wafers, into one package according to the application scenario, packaging substrate, number of layers and other factors, so as to realize a basically complete functional packaging solution. [0003] Taking the power system-in-package shell as an example, the cavity of the power-supply system-in-package shell integrates bare chips or devices such as bonding control chips, MOS tubes, capacitors, inductors, etc., which has the characteristics of high integration and compact layout. . [0004] However, the traditional packaging method has high requirements on the processing technology of the packaging shell, and needs to be plated with different metal coatin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/52H01L23/053
CPCH01L21/50H01L21/52H01L23/053
Inventor 段强杨振涛高岭刘洋李航舟王杰闫军浩
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP