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Laser-assisted adhesive tape and sealing structure comprising same

A sealed structure, laser-assisted technology, applied in the field of materials, can solve problems such as the inability to fully realize the gap bending filling

Pending Publication Date: 2022-06-07
TESA SE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main solution adopted now is to use a thicker foam tape (such as 250-400μm), and use a larger pressure to fill the gap tolerance (such as figure 2 shown), but it cannot adequately fill the gap with bends

Method used

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  • Laser-assisted adhesive tape and sealing structure comprising same
  • Laser-assisted adhesive tape and sealing structure comprising same
  • Laser-assisted adhesive tape and sealing structure comprising same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0121] Example 1 Adhesive Tape 1

[0122] like image 3 As shown, the adhesive tape 1 comprises only an expandable tape layer 1 made from a mixture comprising acrylate pressure sensitive adhesive 1 and Expancel 053 DU40 by coating, drying, slitting and die cutting.

[0123] In the mixture, the weight ratio of the pressure-sensitive adhesive and the foaming agent is 98:2.

[0124] The thickness of the expandable adhesive tape layer 1 is 100 μm.

Embodiment 2

[0125] Example 2 Adhesive Tape 2

[0126] like Figure 4 As shown, the adhesive tape 2 includes in order from top to bottom: a first expandable tape layer, made from a mixture of acrylic pressure-sensitive adhesive 1 and Expancel 920 DU120 in a weight ratio of 98:2, with a thickness of 100 μm;

[0127] The reinforcement layer is made of polyethylene terephthalate with a thickness of 12 μm;

[0128] The second expandable adhesive tape layer, made of a mixture of acrylic pressure-sensitive adhesive 1 and Expancel 920DU120 in a weight ratio of 97:3, had a thickness of 100 μm.

Embodiment 3

[0129] Example 3 Adhesive Tape 3

[0130] like Figure 5 As shown, the adhesive tape 3 sequentially includes from top to bottom: a first adhesive layer, which is made of acrylic pressure-sensitive adhesive 2 and has a thickness of 100 μm;

[0131] The reinforcement layer is made of polyethylene terephthalate with a thickness of 12 μm;

[0132] An expandable tape layer, made from a mixture of acrylic pressure sensitive adhesive 1 and Expancel 920 DU120 in a weight ratio of 97:3, with a thickness of 100 μm.

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Abstract

The invention relates to a laser-assisted adhesive tape and a sealing structure comprising the same. Specifically, under the action of laser, the adhesive tape can be directionally and quantitatively foamed and expanded to fill gaps between components bonded by the adhesive tape. The adhesive tape is particularly suitable for filling irregular gaps.

Description

technical field [0001] The present invention relates to the field of materials, in particular to a laser-assisted adhesive tape and a sealing structure comprising the tape. Background technique [0002] In mobile phones or related electronic industries such as tablets and wearables, more and more device front cases or back covers transition from flat to curved. For example, the flagship grades of almost all mobile phone terminal brands use a curved back cover design, which is what we often call a 3D back cover. The material of these 3D back covers may be glass, plastic or even ceramics and other materials, and the corresponding middle frame is also a curved design. During the production process of the mobile phone, the curved back cover and the curved middle frame need to be bonded together ( like figure 1 and figure 2 shown). However, due to the limitations of the prior art, there is always a relatively large gap tolerance when the two are matched, and this tolerance m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/38C09J7/10C09J7/25H04M1/02H04M1/18
CPCC09J7/385C09J7/10C09J7/255H04M1/026H04M1/18C09J2433/00C09J2467/006C09J7/38C09J2301/208C09J2301/302C09J2301/412C09J2301/408C09J2301/416C08K9/10C09J2203/326
Inventor 刘磊程啸G·玛耶兹
Owner TESA SE